Memory IC S29GL512S10DHA023 product image

S29GL512S10DHA023

$7.38
  • Description:IC FLASH 512MBIT PARALLEL 64FBGA
  • Series:GL-S
  • Mfr:Spansion
  • Package:Bulk

SKU:7a0584012999 Category: Brand:

  
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S29GL512S10DHA023 is listed in the Memory IC range at ChipApex. The manufacturer field lists Spansion. Its product description is IC FLASH 512MBIT PARALLEL 64FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for S29GL512S10DHA023

  • Description:IC FLASH 512MBIT PARALLEL 64FBGA
  • Series:GL-S
  • Mfr:Spansion
  • Package:Bulk
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:512Mbit
  • Memory Organization:32M x 16
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:60ns
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:64-LBGA
  • Supplier Device Package:64-FBGA (9x9)
  • Access Time:100 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for S29GL512S10DHA023

S29GL512S10DHA023

Memory IC Overview

The S29GL512S10DHA023 is a 512-Mbit (64 Mbyte) NOR flash memory component from the Spansion GL-S MirrorBit Eclipse family. It utilizes a 65 nm process technology and operates on a 3.0 V core voltage. The device features an asynchronous parallel interface with a maximum access time of 100 ns. It is housed in a 64-pin Lead-Free Ball Grid Array (LBGA) package, specifically identified as FBGA-64 with dimensions of 9 mm x 9 mm. The memory organization supports 8-bit data bus width, providing non-volatile storage suitable for embedded applications requiring fast random access.

Memory IC Feature Summary

  • MirrorBit Eclipse architecture fabricated on 65 nm CMOS process technology
  • Supports Command User Interface (CUI) for standard flash operations
  • Features Data Polling for status monitoring during program and erase cycles
  • Compatible with Universal Flash Interface standards

Memory IC Applications

  • Embedded code execution in industrial control systems
  • Storage of firmware and boot code in consumer electronics
  • Data logging applications in automotive telematics units
  • Configuration storage in networking infrastructure equipment

Memory IC Procurement Notes

Verify the specific suffix DHA023 against official Spansion or Infineon documentation to confirm package type, temperature range, and lead-free compliance status. Ensure the ordering part number matches the required pinout and electrical specifications for your design. Cross-reference with current datasheets as product lines may transition between manufacturers.

Memory IC Selection Notes

Select this component when a 512-Mbit capacity with 100 ns access speed is required in a compact 64-pin BGA form factor. It is appropriate for designs needing 3.0 V operation and parallel interface compatibility. Consider the 65 nm process benefits for density and power efficiency compared to older technologies. Verify thermal requirements for the LBGA package in your enclosure design.

Memory IC Part Context

This part belongs to the S29GL512S series within the broader GL-S MirrorBit Eclipse family. It shares architectural similarities with other members like the S29GL512S12DHIV10 but differs in access speed and specific package suffixes. The family is characterized by high reliability and support for multiple sector protection schemes, widely used in legacy and modern embedded systems previously dominated by Spansion products now under Infineon.

Memory IC Replacement Considerations

Direct replacements include S29GL512S12DHIV10 for similar functionality with different timing characteristics. Other compatible parts in the GL-S family such as S29GL256S or S29GL128S offer lower densities but share the same interface and package options. Verify pin compatibility and software command set alignment before substitution.

S29GL512S10DHA023S29GL512S10DHA023
$7.38
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