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S325025T-48.000-R is listed in the Oscillators range at ChipApex. The manufacturer field lists Aker Technology Corp. Its product description is XTAL OSC XO 48.0000MHZ HCMOS SMD. Review the specifications below when checking this part for your BOM.
The S325025T-48.000-R is a surface-mount HCMOS clock oscillator manufactured by Aker Technology Corp. It operates at a nominal frequency of 48 MHz with a frequency stability of ±25 ppm. The device supports an enable/disable function and utilizes a standard 2.5 V supply voltage. It features a 4-pin SMD package with no lead construction, designed for compact electronic applications requiring precise timing signals.
Verify the specific part number against official manufacturer documentation to confirm electrical specifications and pinout configuration. Ensure that the selected component meets the required operating temperature range and supply voltage tolerances for the target application environment. Cross-reference datasheet revisions to validate current compliance status and functional parameters before integration into production designs.
Select this oscillator when a stable 48 MHz HCMOS clock source is required with low profile packaging constraints. Consider the ±25 ppm frequency stability specification for applications sensitive to timing jitter. Evaluate the enable/disable feature if dynamic power control is necessary. Confirm that the 2.5 V supply requirement aligns with the system's available voltage rails and load capacitance specifications.
This component belongs to the S325025T series of surface-mount oscillators from Aker Technology Corp. The series typically offers various frequency options within the same physical footprint. These devices are designed to replace discrete crystal and amplifier solutions, providing a complete timing solution in a standardized package format suitable for high-volume manufacturing environments.
Direct substitutes include other 48 MHz HCMOS oscillators with identical pinouts and voltage requirements. Verify equivalent frequency stability and enable functionality when sourcing alternatives. Ensure compatible package dimensions and thermal characteristics to maintain board layout integrity during replacement scenarios.
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