Memory IC S34ML01G200TFI900Z product image

S34ML01G200TFI900Z

$3.37
  • Description:1 GB, 3 V, SLC NAND FLASH
  • Series:*
  • Mfr:Spansion
  • Package:Bulk

SKU:33e08bdb2db2 Category: Brand:

  
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S34ML01G200TFI900Z is listed in the Memory IC range at ChipApex. The manufacturer field lists Spansion. Its product description is 1 GB, 3 V, SLC NAND FLASH. Review the specifications below when checking this part for your BOM.

Memory IC specifications for S34ML01G200TFI900Z

  • Description:1 GB, 3 V, SLC NAND FLASH
  • Series:*
  • Mfr:Spansion
  • Package:Bulk
  • Memory Type:-
  • Memory Format:-
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Memory IC datasheet and documents for S34ML01G200TFI900Z

S34ML01G200TFI900Z

Memory IC Overview

The S34ML01G200TFI900Z is a NAND flash memory component manufactured by Spansion, now part of Infineon Technologies. It features a 1 Gbit storage capacity organized as 512M x 8 bits. The device utilizes a TSOP-48 surface-mount package and supports asynchronous parallel interfaces with x8 I/O configurations. Operating voltages include 3.3 V for both VCC and VCCQ. The architecture incorporates multi-plane capabilities to enhance programming and erasing throughput while supporting hardware write protection via the WP# pin.

Memory IC Feature Summary

  • Multi-plane architecture enabling simultaneous page programming and block erasing operations
  • On-chip programming and erase controller automating internal verification and pulse repetition
  • Read cache functionality designed to improve data read throughput for large files
  • Page reprogramming feature allowing direct data programming in alternative pages upon failure

Memory IC Applications

  • Solid-state drive (SSD) mass storage solutions
  • Consumer electronics firmware storage
  • Industrial control system data logging
  • Automotive infotainment and navigation systems

Memory IC Procurement Notes

Verify the manufacturer origin carefully, as the suffix Z often indicates RoHS compliance or specific regional distribution channels. Confirm the exact package type matches the design requirements, as variations such as BGA or different TSOP styles exist within the same family. Ensure the voltage specifications align with the target system's power rails before integration.

Memory IC Selection Notes

Select this component when a cost-effective solution for high-capacity non-volatile storage is required. The x8 interface option is suitable for systems prioritizing pin count reduction over higher bandwidth. Consider the multi-plane architecture benefits if application performance requires reduced erase times. Verify compatibility with existing ECC implementations to ensure data integrity over the device's lifecycle.

Memory IC Part Context

This part belongs to the S34ML01G series, which provides 1 Gbit density options. The series is designed to replace older generation NOR flash in applications requiring larger storage densities at lower costs. It shares architectural similarities with other Spansion NAND devices but offers specific timing and interface characteristics tailored for general-purpose embedded storage.

Memory IC Replacement Considerations

Direct substitutes may include the S34ML01G200TFI000 or S34ML01G200BHI000, depending on the required package style and lead-free status. Cross-referencing with Cypress Semiconductor equivalents is necessary due to corporate acquisitions. Ensure that any replacement maintains the same voltage levels and interface timing parameters.

S34ML01G200TFI900ZS34ML01G200TFI900Z
$3.37
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