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S34ML02G200BHI000 is listed in the Memory IC range at ChipApex. The manufacturer field lists Spansion. Its product description is IC FLASH 2GBIT PARALLEL 63BGA. Review the specifications below when checking this part for your BOM.
The S34ML02G200BHI000 is a 2 Gbit (256 M x 8) Single-Level Cell (SLC) NAND flash memory component manufactured by SkyHigh Memory, formerly Spansion. It features an asynchronous parallel interface with an 8-bit data bus width. The device operates within a supply voltage range of 2.7 V to 3.6 V and supports a write cycle time of 25 ns for word and page operations. It is housed in a BGA-63 package and is designed for industrial temperature ranges from -40°C to +85°C.
Verify the manufacturer designation as SkyHigh Memory on official documentation, as the model originates from the Spansion portfolio acquired by Macronix. Confirm the specific BGA-63 footprint requirements against your PCB design. Ensure compatibility with the 2.7V to 3.6V power supply rails. Check for moisture sensitivity levels if reflow soldering is required. Validate that the asynchronous timing meets your system's clock constraints.
Select this component when a 2 Gbit capacity with an 8-bit parallel interface is required. It is suitable for applications needing SLC reliability over multi-level cell density. Consider the BGA-63 package size constraints. Verify that the asynchronous access speed of 25 ns aligns with processor timing. Ensure the operating temperature range covers the environmental conditions of the final product.
This part belongs to the S34ML02G2 series of embedded NAND flash memories. The series provides high-density storage solutions using SLC technology. These components are widely used in consumer and industrial devices requiring robust non-volatile storage. The transition from Spansion to SkyHigh Memory reflects corporate restructuring while maintaining technical specifications.
Check for direct substitutes within the S34ML02G2 family, such as variants with different suffixes indicating package or temperature grades. Verify pin-to-pin compatibility before substitution. Review datasheets for any changes in electrical characteristics or interface protocols.
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