S34MS01G204BHI013

Memory IC Overview

The S34MS01G204BHI013 is a NAND flash memory component manufactured by Spansion, also identified under the SkyHigh Memory brand. It features a storage capacity of 64 Meg words by 16 bits, organized as 64MX16. The device utilizes a Parallel interface with Asynchronous timing characteristics. It is housed in a PBGA63 package, specifically BGA-63. Official documentation indicates a access speed of 45ns. The component supports surface mount installation and operates within standard industrial temperature ranges.

Memory IC Feature Summary

• Provides non-volatile data storage using Single-Level Cell (SLC) NAND technology for reliable retention.
• Supports parallel asynchronous interface for direct connection to microprocessors and controllers.
• Designed for high-density applications requiring robust data integrity and long-term endurance.

Memory IC Applications

• Consumer electronics devices requiring embedded firmware storage
• Networking equipment including routers and switches
• Automotive infotainment and control systems

Memory IC Procurement Notes

Verify the manufacturer designation carefully, as this part number appears in databases linked to both Spansion and SkyHigh Memory. Confirm the specific datasheet version matches the required 45ns timing and BGA-63 package dimensions. Ensure compatibility with the target system's voltage levels and interface protocols before integration.

Memory IC Selection Notes

Select this component when a 1 Gigabit density is required in a compact BGA footprint. It is suitable for designs needing parallel access without complex serial interfaces. Consider the thermal profile of the BGA-63 package during PCB layout. Verify that the asynchronous timing meets the processor's clock requirements for stable operation.

Memory IC Part Context

This part belongs to the S34MS series of NAND flash memories, originally developed by Spansion, which was later acquired by Cypress Semiconductor and subsequently Infineon Technologies. The series is known for providing cost-effective storage solutions for mass-market electronic devices. The specific suffix denotes the package type and pin configuration unique to the BGA-63 form factor.

Memory IC Replacement Considerations

Cross-reference with S34MS01G204BHA003 for potential pin-compatible alternatives from Cypress. Check S34MS04G204BHI010 if higher density or different organization is acceptable. Verify electrical specifications against any newer revisions from Infineon or SkyHigh Memory.