S34MS02G204BHI010

Memory IC Overview

The S34MS02G204BHI010 is a NAND flash memory component manufactured by Spansion. It features a storage capacity of 2 Gbit with an organization of 256M x 8 bits. The device utilizes a parallel interface and operates asynchronously. It is housed in a BGA-63 package. The operational voltage range spans from 1.7 V to 1.95 V, with a maximum active read current of 20 mA. The specified operating temperature range extends from -40 °C to +85 °C.

Memory IC Feature Summary

• Supports asynchronous parallel data access for system integration
• Provides reliable non-volatile data retention within the industrial temperature range
• Compatible with standard 1.8V logic levels for embedded applications

Memory IC Applications

• Industrial control systems requiring robust data storage
• Embedded firmware storage in consumer electronics
• Automotive infotainment and telematics modules

Memory IC Procurement Notes

Verify the manufacturer origin as Spansion or its successor entities during sourcing. Confirm the specific suffix BHI010 matches the required BGA-63 package and commercial/industrial temperature grade. Ensure compatibility with existing board layouts designed for this pin configuration before procurement.

Memory IC Selection Notes

Select this part when a 2 Gbit density with an 8-bit wide parallel interface is required. The BGA-63 form factor suits space-constrained designs. Verify that the 1.8V supply rail aligns with the target system architecture. Consider the asynchronous timing characteristics for controller interface design.

Memory IC Part Context

This component belongs to the S34MS series of NAND flash memories. The series typically offers high-density storage solutions for various embedded applications. Variants within the family differ by density, interface width, and package type. This specific model represents the 2 Gbit tier with parallel connectivity.

Memory IC Replacement Considerations

Check for direct substitutes such as S34MS02G204BHI000 or other variants within the same series that share the BGA-63 package and 256M x 8 organization. Cross-reference datasheets to ensure identical electrical specifications and pinouts.