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S6K is listed in the Single Diodes range at ChipApex. The manufacturer field lists GeneSiC Semiconductor. Its product description is DIODE STANDARD 800V 6A DO4. Review the specifications below when checking this part for your BOM.
The GeneSiC Semiconductor S6K is a silicon standard recovery rectifier diode designed for stud mounting applications. It features a DO-4 (DO-203AA) package with a maximum repetitive peak reverse voltage of 1000 V and a continuous forward current rating of 6 A. The device supports an operating junction temperature range from -55 °C to 150 °C, with a thermal resistance from junction to case of 2.50 °C/W. Standard polarity configuration designates the stud as the cathode.
Verify the specific voltage variant required, as the S6K designation corresponds to the 1000 V rating within the S6Q series family. Confirm terminal orientation requirements; standard units have the stud as the cathode, while reversed polarity variants are available with suffixes. Ensure mounting hardware matches the 10-32 UNF thread specification for secure installation.
Select this component when a 6 A continuous current rating and 1000 V blocking voltage are necessary for standard recovery applications. The DO-4 package provides a compact footprint suitable for chassis or panel mounting where stud-based thermal management is preferred over leaded packages. Evaluate thermal resistance constraints against the system's heat sink capabilities.
The S6K belongs to the S6Q series of silicon standard recovery rectifiers manufactured by GeneSiC Semiconductor. This series encompasses multiple voltage ratings ranging from 800 V to 1200 V, all sharing identical mechanical dimensions and current ratings. The series is characterized by its rugged DO-4 stud mount package designed for industrial environments.
Direct substitutes include other 1000 V, 6 A stud-mount standard recovery diodes in the DO-4 package. Verify that replacement parts match the 2.50 °C/W thermal resistance and 10-32 UNF mounting thread specifications to ensure compatibility with existing heatsink interfaces.
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