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The SA14069UBDR2 is a hex inverter integrated circuit manufactured by onsemi, belonging to the 4000B series. It features six independent inverters with one input per gate, housed in a 14-SOIC surface-mount package. The device operates within a supply voltage range of 3V to 15V and supports logic high levels from 4V to 12V and logic low levels from 1V to 3V. Key electrical specifications include a maximum static current of 1 µA, output currents of 3.4mA for both high and low states, and a maximum propagation delay of 50ns at 15V with a 50pF load. It functions reliably across an operating temperature range of -55°C to 125°C.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and lead-free material declarations prior to procurement. Check for obsolescence notices as this part may be discontinued; validate availability of active stock versus last-time buy options. Ensure packaging specifications match production requirements, specifically regarding tape and reel quantities for automated assembly processes.
Select this component when designing circuits requiring multiple inverted signals within a compact surface-mount footprint. Consider the 14-SOIC package dimensions for PCB layout constraints. Evaluate the 50ns propagation delay against system timing requirements. Verify that the 3V-15V supply range aligns with available power rails. Assess thermal management needs given the -55°C to 125°C operating range for harsh environments.
This hex inverter belongs to the industry-standard 4000B CMOS logic family, known for wide voltage tolerance and low static power consumption. The CD4069 designation represents the base functional type, while the SA14069UBDR2 suffix indicates specific manufacturing and packaging variations by onsemi. It serves as a fundamental building block for complex digital systems requiring reliable logical negation functions.
Public confirmed substitutes include MC14069UBDG and MC14069UBDR2G from onsemi. These alternatives offer similar pinout compatibility and functional characteristics. Verify package integrity and electrical parameter alignment before substitution. Cross-reference datasheets to ensure equivalent propagation delays and current drive capabilities for seamless integration.