SA58637BS,118

SA58637BS,118

  • Description:IC AMP CLSS AB STER 2.2W 20HVQFN
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:79fbc1fe7bda Category: Brand:

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Product Detailed Parameters

  • Description:IC AMP CLSS AB STER 2.2W 20HVQFN
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Type:Class AB
  • Output Type:2-Channel (Stereo)
  • Max Output Power x Channels @ Load:2.2W x 2 @ 8Ohm
  • Voltage - Supply:2.2V ~ 18V
  • Features:Depop, Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type:Surface Mount
  • Supplier Device Package:20-HVQFN (5x6)
  • Package / Case:20-VQFN Exposed Pad
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Grade:-
  • Qualification:-

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SA58637BS,118

Overview

The SA58637BS,118 is a two-channel audio amplifier in an HVQFN20 package. It provides power output of 2.2 W per channel with an 8 Ω load at 9 V supply. The internal circuit is comprised of two Bridge-Tied Load (BTL) amplifiers with a complementary PNP-NPN output stage and standby/mute logic. The SA58637 is housed in a 20-pin HVQFN package, which has an exposed die attach paddle enabling reduced thermal resistance and increased power dissipation.

Feature Summary

  • Low junction-to-ambient thermal resistance using exposed die attach paddle
  • Gain can be fixed with external resistors from 6 dB to 30 dB
  • Standby mode controlled by CMOS-compatible levels
  • Low standby current less than 10 μA

Applications

  • Professional and amateur mobile radio
  • Portable consumer products: toys and games
  • Personal computer remote speakers

Procurement Notes

Verify the exact ordering suffix matches the required package variant. Confirm that the component status aligns with current production requirements. Check for any specific environmental compliance certifications relevant to the intended deployment region. Ensure the datasheet revision corresponds to the latest technical specifications before finalizing procurement decisions.

Selection Notes

Select this component when a dual-channel BTL configuration is required for compact audio designs. The exposed die attach paddle facilitates efficient heat dissipation in space-constrained layouts. Verify that the operating voltage range and gain settings meet the system's power and signal requirements. Consider the low standby current for battery-operated applications requiring extended operational longevity.

Part Context

This device belongs to NXP Semiconductors' audio amplifier portfolio, specifically designed for high-efficiency sound reproduction in portable electronics. The HVQFN20 package allows for dense PCB mounting while maintaining thermal performance through the integrated heat spreader capabilities.

Replacement Considerations

Consult official NXP documentation for verified substitute part numbers. Cross-reference pinouts and electrical characteristics carefully to ensure functional compatibility without redesigning the host circuit board.

SA58637BS,118SA58637BS,118

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