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SAM9X60D6K-I/4GB is listed in the Microprocessors range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC MPU SAM9X 600MHZ 196TFBGA. Review the specifications below when checking this part for your BOM.
The SAM9X60D6K-I/4GB is a System-in-Package microprocessor integrating an ARM926EJ-S core running at 600 MHz with 64-Mbit SDR-SDRAM. It features a 196-ball TFBGA package (11x11 mm) and includes 32-Kbyte instruction and data caches, an MMU, and 64-Kbyte internal SRAM. The device supports multiple interfaces including USB, Ethernet, LCD, and CAN, operating within a -40°C to +85°C temperature range.
Verify the specific suffix 'I' indicates industrial temperature grade (-40°C to +85°C). Confirm the 'D6K' designation corresponds to the 64-Mbit SDR-SDRAM variant rather than DDR2 options. Ensure ordering documentation matches the 196-ball TFBGA package dimensions. Cross-reference the datasheet revision DS60001580A for any errata updates.
Select this component when board space constraints require integrated memory alongside the MPU. Choose over discrete solutions if EMI reduction through shorter signal traces is critical. Consider the 196-ball package for standard PCB layer counts compared to larger BGA options. Verify peripheral requirements match the available FLEXCOM and USB controllers.
Part of the SAM9X series MPUs designed for Linux and bare-metal applications. The D6K variant specifically targets cost-sensitive designs using SDR-SDRAM instead of higher-bandwidth DDR2. It shares the core architecture with DDR2 variants but offers a smaller footprint suitable for simpler embedded tasks.
SAM9X60D5M: Offers 512-Mbit DDR2-SDRAM in a larger 233-ball package. SAM9X60D1G: Provides 1-Gbit DDR2-SDRAM in a 233-ball package. Both alternatives require different PCB layouts due to increased ball count and pitch differences.
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