SB130

Single Diodes Overview

The SB130 is a Schottky rectifying diode manufactured by SMC Diode Solutions, designed for through-hole mounting in the DO-41 (DO-204AL) axial package. It features a maximum DC reverse voltage of 30 V and an average forward rectified current of 1 A. The device exhibits a typical forward voltage of 850 mV at 1 A and a maximum reverse leakage current of 500 µA at 30 V. Operating junction temperature ranges from -65°C to +175°C, ensuring reliability under thermal stress.

Single Diodes Feature Summary

• Schottky barrier technology enables low forward voltage drop and high switching efficiency
• Axial leaded construction supports robust through-hole PCB integration
• Extended operating junction temperature range up to 175°C

Single Diodes Applications

• General purpose rectification in power supplies
• Free-wheeling diodes in inductive load circuits
• Reverse polarity protection in electronic systems

Single Diodes Procurement Notes

Verify the specific ordering suffix against manufacturer documentation to confirm packaging format, such as cut tape or tube, as these do not alter electrical characteristics. Confirm RoHS compliance status and moisture sensitivity level requirements prior to procurement to ensure compatibility with assembly processes.

Single Diodes Selection Notes

Select this component when a low-loss rectification solution is required for moderate voltage applications. The DO-41 package suits designs prioritizing mechanical durability over miniaturization. Ensure circuit peak inverse voltage remains below the 30 V rating to prevent breakdown.

Single Diodes Part Context

Part of the SB series of silicon Schottky rectifiers, the SB130 complements higher voltage variants like the SB140 and SB160. This series provides efficient power conversion capabilities for consumer electronics and industrial control equipment requiring reliable unidirectional current flow.

Single Diodes Replacement Considerations

Equivalent alternatives include the 1N5817 or MBRS130T3G. Verify pinout compatibility and thermal management requirements when substituting to maintain circuit performance integrity.