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SBR15300D1-13 is listed in the Single Diodes range at ChipApex. The manufacturer field lists Diodes Incorporated. Its product description is DIODE SBR 300V 15A TO252 TYPE TH. Review the specifications below when checking this part for your BOM.
The SBR15300D1-13 is a Super Barrier Rectifier diode manufactured by Diodes Incorporated, housed in a TO252 (DPAK) surface-mount package. It features a peak repetitive reverse voltage of 300 V and an average rectified output current of 15 A. The maximum forward voltage drop is 1.01 V at 15 A and +25°C, with a non-repetitive peak forward surge current rating of 110 A. Reverse leakage current is limited to 10 µA at 300 V and +25°C. The device operates within a junction temperature range of -55°C to +175°C.
Verify the specific ordering suffix '-13' corresponds to the 2,500 pieces per reel tape-and-reel packaging configuration. Confirm compliance requirements such as RoHS 3 and halogen-free status against project specifications. Ensure thermal management design accounts for the specified junction-to-case thermal resistance when calculating power dissipation limits under load conditions.
Select this component for designs requiring a 300 V blocking capability with a 15 A continuous current rating in a compact DPAK footprint. Evaluate the 1.01 V forward voltage drop against efficiency targets compared to standard silicon rectifiers. Consider the 110 A surge current capacity for transient protection scenarios and verify that the -55°C to +175°C operating range meets environmental constraints.
This part belongs to the SBR series of Super Barrier Rectifiers from Diodes Incorporated, combining Schottkin-like speed with standard silicon ruggedness. The SBR15300D1-13 specifically utilizes the TO252 case style for surface mount assembly. It is designed for commercial general-purpose applications where low conduction losses and high-temperature reliability are required.
Consult official manufacturer substitution guides for verified equivalents. Cross-reference electrical parameters including voltage, current, and package dimensions before implementation.
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