SBSGP5000682MXT

Overview

The Knowles Syfer SBSGP5000682MXT is a surface-mount EMI filter circuit designed for high-frequency noise suppression. It features a Pi-filter topology with a capacitance of 6800 pF (6.8 nF) and an X7R dielectric. The component supports a DC voltage rating of 500 V and a current rating of 5 A. Its physical dimensions are 5.25 mm in length, 3.2 mm in width, and it utilizes SMD/SMT solder terminations.

Feature Summary

• Integrates a third-order low-pass Pi-filter network within a compact surface-mount package
• Utilizes X7R ceramic dielectric material for stable capacitance performance across operating temperatures
• Engineered for high-current applications with a 5 A rated current capacity

Applications

• EMI/RFI filtering in power supply input stages
• Noise suppression in automotive electronic control units
• Signal integrity protection in industrial communication interfaces

Procurement Notes

Verify the complete part number including the suffix MXT to ensure correct reel packaging configuration. Confirm that the 1812 (4532 Metric) footprint matches the target PCB layout. Ensure design compatibility with the specified 500 VDC and 5 A ratings for the intended application environment.

Selection Notes

Select this component when a integrated Pi-filter solution is required to save board space compared to discrete components. The 1812 package size offers a balance between thermal handling and miniaturization. Verify that the X7R temperature coefficient meets the operational stability requirements of the specific circuit design.

Part Context

This component belongs to the Knowles Syfer SBSGP series of surface-mount EMI filter circuits. These devices combine multiple passive elements into a single monolithic structure to reduce parasitic inductance and improve high-frequency attenuation performance compared to discrete implementations.

Replacement Considerations

Direct substitutes must match the 1812 footprint, 6800 pF capacitance, 500 V rating, and Pi-filter topology. Verify pinout compatibility and thermal characteristics before substitution.