SC-20-D010

Overview

The KEMET SC-20-D010 is a through-hole common-mode choke designed for electromagnetic interference suppression. It features an inductance of 10 µH measured at 100 kHz and supports a maximum DC current of 20 A. The component exhibits a maximum DC resistance of 8 mΩ. It operates within a temperature range of -25 °C to +105 °C.

Feature Summary

• Provides common-mode noise attenuation for two-line circuits
• Supports high continuous direct current loads up to 20 A
• Utilizes through-hole mounting technology for mechanical stability

Applications

• Power supply input filtering
• DC line noise suppression
• Electromagnetic compatibility (EMC) mitigation in industrial equipment

Procurement Notes

Verify the specific datasheet version to confirm lead times and packaging details, as these are subject to change. Ensure the procurement channel provides traceability documentation required for quality assurance. Confirm that the component meets all necessary regulatory standards for the intended deployment environment before finalizing orders.

Selection Notes

Select this component when high current handling capacity is required alongside effective common-mode noise reduction. The low DC resistance minimizes power loss in high-current paths. Verify that the physical dimensions and through-hole spacing align with the target printed circuit board layout constraints.

Part Context

This component belongs to KEMET's passive electronic components portfolio, specifically within the magnetic components category. Common-mode chokes are essential for maintaining signal integrity and reducing radiated emissions in electronic systems. This model represents a standard solution for power line filtering applications requiring robust current handling capabilities.

Replacement Considerations

Consult official KEMET substitution guides or equivalent manufacturer databases to identify compatible alternatives. Verify that any substitute part matches the 10 µH inductance, 20 A current rating, and 8 mΩ resistance specifications. Ensure physical footprint compatibility for through-hole installation.