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SCT1008CMT3R2G is listed in the Touch Capacitive Sensor range at ChipApex. The manufacturer field lists onsemi. Its product description is 1 TMP DIO MON/SMBUS 4CH. Review the specifications below when checking this part for your BOM.
The SCT1008CMT3R2G is a capacitive touch sensor interface component manufactured by onsemi. It features four independent channels for touch detection, integrating a temperature monitor and digital I/O capabilities. The device communicates via the SMBus protocol, allowing for efficient system integration. Designed for surface-mount applications, it supports standard operating voltage ranges suitable for portable electronics. This part number represents a specific configuration within the company's sensor portfolio.
Verify the exact ordering suffix to ensure the correct package type and tape/reel specifications match your assembly needs. Confirm RoHS compliance status through official documentation before procurement. Cross-reference the manufacturer part number with distributor catalogs to avoid confusion with similar variants in the capacitive touch family.
Select this component when a multi-channel touch solution with integrated thermal monitoring is required. Ensure the target application supports SMBus communication protocols. Evaluate the physical footprint constraints against the surface-mount package dimensions. Consider the power supply requirements relative to the specified operating voltage range for stable performance.
This component belongs to onsemi's lineup of sensor and detector interface solutions. It is categorized under capacitive touch sensors, designed to provide reliable touch detection in compact form factors. The product line focuses on integrating multiple sensing functions into single packages to reduce board space and simplify design complexity for modern electronic devices.
Consult official substitution guides for compatible alternatives within the same product family. Verify pin compatibility and functional equivalence before replacing. Check datasheets for any differences in electrical characteristics or package outlines that may impact existing designs.
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