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SDB153-TP is listed in the Bridge Rectifier range at ChipApex. The manufacturer field lists MCC (Micro Commercial Components). Its product description is BRIDGE RECT 1P 200V 1.5A SDB-1. Review the specifications below when checking this part for your BOM.
The SDB153-TP is a single-phase bridge rectifier from Micro Commercial Components (MCC), rated for an average forward current of 1.5 A and a peak repetitive reverse voltage of 200 V. It utilizes a glass-passivated chip junction within a surface-mount SDB-1 package, measuring approximately 10.4 mm in length and 8.51 mm in width. The device supports a maximum operating junction temperature of 150°C and offers a non-repetitive peak surge current capability of 50 A under standard half-sine wave conditions.
Verify the authenticity of the SDB153-TP by purchasing exclusively from MCC or authorized distributors to avoid counterfeit components. Confirm that the ordering suffix indicates tape and reel packing with a quantity of 1,500 pieces per reel. Ensure the product meets RoHS compliance standards as specified in the manufacturer's documentation before integration into final assemblies.
Select the SDB153-TP when a 200 V reverse voltage rating is required alongside a 1.5 A continuous current capacity in a compact surface-mount form factor. Consider its thermal resistance characteristics and derating curves for high-temperature environments. Evaluate the specific marking code requirements for PCB silkscreen alignment during the component selection phase.
This component belongs to the SDB151 through SDB157 series of single-phase bridge rectifiers manufactured by Micro Commercial Components. The series shares identical physical dimensions and electrical current ratings, differing primarily in their peak repetitive reverse voltage capabilities ranging from 50 V to 1000 V. The SDB153-TP specifically occupies the 200 V rating position within this standardized lineup.
Direct replacements must match the 1.5 A current rating, 200 V reverse voltage, and SDB-1 surface-mount package dimensions. Verify equivalent thermal resistance and forward voltage characteristics to ensure circuit performance compatibility without redesigning the layout.
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