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SDIN5B2-32G is listed in the Memory IC range at ChipApex. The manufacturer field lists SanDisk. Its product description is IC FLASH 256GBIT EMMC 169TFBGA. Review the specifications below when checking this part for your BOM.
The SanDisk SDIN5B2-32G is a 32GB Embedded Flash Drive utilizing the e.MMC 4.41 interface and MLC NAND technology. It operates within an industrial temperature range of -25°C to +85°C with core voltage (VCC) between 2.7V and 3.6V, and I/O voltage (VCCQ) at either 1.7-1.95V or 2.7-3.6V. The device supports 1-bit, 4-bit, and 8-bit data bus widths with clock frequencies up to 52 MHz. Sustained read performance reaches 20 MB/s, while sustained write performance is rated at 8 MB/s for X3 configurations.
Verify the specific package dimensions against the datasheet, as the 32GB variant utilizes a 12mm x 18mm footprint with a maximum height of 1.40 mm. Confirm that the host system supports the required VCCQ voltage levels (1.7-1.95V or 2.7-3.6V) and the e.MMC 4.41 protocol. Ensure environmental conditions remain within the specified -25°C to +85°C operating range for reliable performance.
Select this component for applications requiring robust, plug-and-play storage integration without complex host software updates. The device's technology independence allows future firmware upgrades without changing host drivers. Consider the 12x18mm package size for board space constraints and verify compatibility with DDR signaling if higher bus performance is required by the system design.
This part belongs to the SanDisk iNAND family of Embedded Flash Drives designed for mobile and consumer electronics. It combines an embedded flash controller with standard MLC NAND flash in a JEDEC-compatible form factor. The series is engineered for high reliability and mass storage in portable devices, offering seamless integration through standardized MMC interfaces.
Compatible replacements within the same iNAND family include other 32GB e.MMC 4.41 variants such as those with different package sizes (e.g., 14mm x 18mm), provided the pinout and electrical specifications match the host design requirements.
Yes, the device implements HPI on its MLC products to enable low read latency by suspending lower priority operations.
The maximum device height (A) for the SDIN5B2-32G is 1.40 mm, which differs from the standard 1.20 mm height of smaller capacity variants.
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