SE2603L-R

Overview

The SE2603L-R is a silicon-based RF front-end module designed for 2.4 GHz WLAN applications supporting IEEE 802.11b/g/n standards. It integrates power amplification, filtering, and switching functions within a QFN-24 surface-mount package. The component operates at a supply voltage of 3.3 V with a maximum current consumption of 180 mA. It supports data rates up to 11 Mbps and functions reliably across an operating temperature range from -30°C to +85°C.

Feature Summary

• Integrates transmit/receive switching, power amplification, and filtering for simplified RF front-end design
• Optimized for low-power operation in 2.4 GHz wireless local area network environments
• Utilizes silicon MMIC technology for compact integration in space-constrained mobile devices

Applications

• Wi-Fi enabled smartphones and tablets
• Wireless LAN access points and routers
• Bluetooth-enabled consumer electronics
• IoT modules requiring 2.4 GHz connectivity

Procurement Notes

Verify the specific suffix 'R' corresponds to the reel packaging configuration required for automated assembly processes. Confirm RoHS compliance status through official manufacturer documentation prior to procurement. Ensure the component meets all environmental specifications for the intended operational temperature range. Validate that the QFN-24 footprint matches the PCB layout requirements exactly.

Selection Notes

Select this component when designing systems requiring integrated transmission and reception capabilities for 802.11b/g/n protocols. Consider the 3.3 V supply requirement and 180 mA current draw against system power budgets. Evaluate the QFN-24 package dimensions for thermal management and spatial constraints. Compare performance metrics against alternative front-end solutions to ensure compatibility with existing antenna architectures.

Part Context

This part belongs to Skyworks Solutions' portfolio of wireless RF integrated circuits. It is categorized under RF Front Ends specifically tailored for WLAN applications. The product utilizes silicon technology and is housed in a QFN-24 package. It serves as a critical component for managing signal integrity in 2.4 GHz communication links.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify functional equivalence carefully if considering alternative components from other manufacturers.