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SE2623L-RP is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Skyworks Solutions Inc.. Its product description is SKYWORKS. Review the specifications below when checking this part for your BOM.
The SE2623L-RP is a high-power wireless LAN power amplifier designed for 802.11b/g/n, DSSS, ISM, and WLAN applications operating within the 2.4 GHz to 2.5 GHz frequency range. Manufactured by Skyworks Solutions Inc., this RF amplifier IC utilizes silicon technology and is housed in a 16-QFN (3x3) package. It supports surface mount installation and operates with a supply voltage of 5 V and a current consumption of 600 mA. The device provides a gain of 33 dB and achieves a P1dB compression point of 31 dBm. It functions reliably across a temperature range from -40°C to +85°C.
Verify the specific suffix against official Skyworks documentation to confirm exact reel specifications and moisture sensitivity levels. Ensure compatibility with standard SMD/SMT assembly processes. Confirm that the 16-QFN (3x3) footprint matches the target PCB layout requirements before finalizing procurement decisions.
Select this component for applications requiring high output power in the 2.4 GHz ISM band. The 33 dB gain and 31 dBm P1dB performance suit high-power PA roles. Consider the 5 V supply requirement and 600 mA current draw during power budgeting. The small form factor makes it suitable for dense circuit board layouts.
This part belongs to the Skyworks SE2623L series of wireless LAN power amplifiers. It serves as the active semiconductor component for signal boosting in Wi-Fi infrastructure. The RP suffix typically denotes a specific tape-and-reel packaging configuration for automated manufacturing, distinct from bulk or cut-tape variants.
Publicly confirmed substitute part numbers are not available in the provided source material.
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