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SE555JGB is listed in the Programmable Timers And Oscillators range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is PRECISION TIMER 8-CDIP -55 TO 12. Review the specifications below when checking this part for your BOM.
The SE555JGB is a precision timer integrated circuit manufactured by Texas Instruments, belonging to the SE555 series. It features a single internal timer with TTL output type and operates within a supply voltage range of 4.5 V to 18 V. The device supports high-level and low-level output currents of 200 mA each, with a typical operating supply current of 4 mA. Designed for robust performance, it functions across an extended temperature range from -55°C to +125°C. The component is housed in an 8-pin Ceramic Dual In-Line Package (CDIP) suitable for through-hole mounting.
Verify the specific ceramic dual in-line package configuration and lead-free status against the manufacturer's latest datasheet revision. Confirm that the ordering suffix corresponds to the required military-grade or commercial-grade temperature specifications. Ensure compatibility with existing PCB footprints designed for 8-lead CDIP components before finalizing procurement orders.
Select this component when high-output current capability and wide voltage tolerance are required alongside precision timing accuracy. The ceramic package offers superior thermal stability compared to plastic variants, making it suitable for applications demanding long-term reliability under extreme temperature fluctuations. Consider the through-hole mounting requirement during layout design.
As part of the SE555 family, this timer IC provides a standardized solution for analog timing applications. The JGB suffix typically denotes a specific package and material combination, distinguishing it from plastic or metal can equivalents. It serves as a direct replacement for standard NE555 designs where enhanced performance and ruggedness are prioritized over cost reduction.
Compatible substitutes include the SE555DR for surface-mount requirements and SE555P for plastic DIP packaging. Verify pinout compatibility and electrical parameter overlaps when transitioning between package types to ensure seamless integration without redesigning surrounding circuitry.
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