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SE868SYD130R001000 is listed in the RF Receivers range at ChipApex. The manufacturer field lists Telit Cinterion. Its product description is SE868SY-D MODULE FW1.3.0-N115 L1. Review the specifications below when checking this part for your BOM.
The SE868SYD130R001000 is a multi-frequency, multi-constellation GNSS module from Telit Cinterion. It supports GPS, GLONASS, Galileo, BeiDou, QZSS, and NAVIC constellations across L1 and L5 frequency bands. The module features a 32-QFN package measuring 10.95 x 10.95 mm with a height of 2.8 mm. It operates on an I2C, SPI, or UART interface. Key performance metrics include a cold start acquisition time of 29 seconds and a horizontal position accuracy of 1 meter. The operating voltage range is 1.71 V to 1.89 V, with a functional temperature range of -40°C to +85°C.
Verify the specific firmware version and hardware revision against project requirements before procurement. Confirm that the 32-QFN footprint matches the PCB layout design. Ensure the power supply circuitry strictly adheres to the specified 1.71 V to 1.89 V operating range. Check current availability status as manufacturing lifecycle changes may affect stock levels.
Select this module when dual-frequency L1/L5 support is required for high-precision applications. Choose over single-frequency variants if multipath mitigation in urban environments is critical. Verify compatibility with existing baseband processors regarding I2C, SPI, or UART interface selection. Consider the compact 32-QFN form factor for space-constrained designs.
This component belongs to the SE868SY series of GNSS modules by Telit Cinterion. The 'D' suffix typically denotes dual-band capability compared to single-band counterparts like the SE868SYS variant. The series is designed for robust positioning in challenging RF environments using advanced signal processing techniques.
The SE868SYS130R001000 is a related single-band variant within the same family. Substitution requires verification of frequency band requirements and potential firmware adjustments. Cross-referencing pinouts and mechanical dimensions is essential for direct replacement scenarios.
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