SE97TP/S900,547

SE97TP/S900,547

$0.45
  • Description:IC TEMP SENSOR DIMM 3.3V 8-HWSON
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:69bb19781319 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC TEMP SENSOR DIMM 3.3V 8-HWSON
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Function:Temp Monitoring System (Sensor), DIMM DDR Memory
  • Sensor Type:Internal
  • Sensing Temperature:-40°C ~ 125°C
  • Accuracy:±3°C
  • Topology:ADC (Sigma Delta), Comparator, Register Bank
  • Output Type:2-Wire Serial, I2C/SMBUS
  • Output Alarm:Yes
  • Output Fan:Yes
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-40°C ~ 125°C
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:8-WFDFN Exposed Pad
  • Supplier Device Package:8-HWSON (2x3)

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SE97TP/S900,547

Overview

The SE97TP/S900,547 is a board-mount temperature sensor with integrated Serial Presence Detect (SPD) EEPROM. It measures temperatures from -40 °C to +125 °C using an 11-bit ADC with 0.125 °C resolution. The device provides JEDEC Grade B accuracy of ±1 °C maximum between +75 °C and +95 °C. It operates on a VDD supply of 3.0 V to 3.6 V, with the EEPROM supporting read operations down to 1.7 V. Communication occurs via a 2-wire I2C-bus/SMBus interface up to 400 kHz. The component includes programmable alarm trip points and an open-drain EVENT output.

Feature Summary

  • Integrates a local temperature sensor with a 256-byte serial EEPROM for SPD functionality
  • Supports SMBus TIMEOUT and ALERT Response Address features to prevent system lock-ups
  • Features configurable EVENT output modes including comparator and interrupt operations
  • Provides software write protection capabilities for memory data security

Applications

  • DDR2 and DDR3 memory modules
  • Laptops and personal computers
  • Enterprise networking equipment
  • Hard disk drives and PC peripherals

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current documentation to ensure package compatibility and manufacturing origin alignment. Confirm that the selected variant meets the required JEDEC specifications for the target memory application. Check for any updates regarding the availability of the HWSON8 package type in the latest product data sheets before finalizing procurement plans.

Selection Notes

Select this component when designing systems requiring precise DRAM thermal monitoring alongside standard SPD storage. Ensure the host controller supports the required I2C/SMBus protocols and can handle the open-drain EVENT output configuration. Consider the power supply voltage range and the need for external pull-up resistors on the communication lines during the initial hardware design phase.

Part Context

This part belongs to the NXP SE97 family of DDR memory module temperature sensors. It replaces traditional Serial Presence Detect chips by combining temperature sensing with vendor information storage. The device is designed to help chipset throttling mechanisms estimate DRAM case temperature more accurately than motherboard-mounted sensors.

Replacement Considerations

SE97BTP,547

SE97TP/S900,547SE97TP/S900,547
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