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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The SE97TP/S900,547 is a board-mount temperature sensor with integrated Serial Presence Detect (SPD) EEPROM. It measures temperatures from -40 °C to +125 °C using an 11-bit ADC with 0.125 °C resolution. The device provides JEDEC Grade B accuracy of ±1 °C maximum between +75 °C and +95 °C. It operates on a VDD supply of 3.0 V to 3.6 V, with the EEPROM supporting read operations down to 1.7 V. Communication occurs via a 2-wire I2C-bus/SMBus interface up to 400 kHz. The component includes programmable alarm trip points and an open-drain EVENT output.
Verify the specific ordering suffix against the manufacturer's current documentation to ensure package compatibility and manufacturing origin alignment. Confirm that the selected variant meets the required JEDEC specifications for the target memory application. Check for any updates regarding the availability of the HWSON8 package type in the latest product data sheets before finalizing procurement plans.
Select this component when designing systems requiring precise DRAM thermal monitoring alongside standard SPD storage. Ensure the host controller supports the required I2C/SMBus protocols and can handle the open-drain EVENT output configuration. Consider the power supply voltage range and the need for external pull-up resistors on the communication lines during the initial hardware design phase.
This part belongs to the NXP SE97 family of DDR memory module temperature sensors. It replaces traditional Serial Presence Detect chips by combining temperature sensing with vendor information storage. The device is designed to help chipset throttling mechanisms estimate DRAM case temperature more accurately than motherboard-mounted sensors.
SE97BTP,547