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Product Detailed Parameters
- Description：IC TEMP SENSOR DDR 8-TSSOP
- Series：-
- Mfr：NXP USA Inc.
- Package：Tape & Reel (TR),Bulk
- Function：Temp Monitoring System (Sensor)
- Sensor Type：Internal
- Sensing Temperature：-40°C ~ 125°C
- Accuracy：±4°C(Max)
- Topology：ADC (Sigma Delta), Register Bank
- Output Type：I2C/SMBus
- Output Alarm：Yes
- Output Fan：Yes
- Voltage - Supply：1.7V ~ 3.6V
- Operating Temperature：-40°C ~ 125°C
- Grade：-
- Qualification：-
- Mounting Type：Surface Mount
- Package / Case：8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Supplier Device Package：8-TSSOP
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Overview
The SE98APW,118 is a board-mount temperature sensor manufactured by NXP USA Inc., designed for thermal management applications. It features an internal sensor with I2C and SMBus interface compatibility, operating within a voltage range of 1.7V to 3.6V. The device provides local temperature monitoring with an accuracy of +/-1°C. It is housed in an 8-TSSOP package and supports surface mount technology. The component operates reliably across a temperature range of -40°C to +125°C.
Feature Summary
- Compliant with European Union environmental standards including ROHS certification and REACH directive
- Supports I2C and SMBus digital interfaces for system integration
- Designed for DDR memory temperature monitoring applications
Applications
- DDR memory temperature monitoring
- Board-level thermal management systems
- I2C/SMBus compatible electronic devices requiring local temperature sensing
Procurement Notes
Verify part status as obsolete before procurement planning. Confirm package type matches 8-TSSOP specifications. Ensure interface compatibility with existing I2C or SMBus controllers. Check for alternative components if current supply chain constraints exist due to end-of-life status.
Selection Notes
Select this component for applications requiring precise local temperature monitoring with digital output. Consider the operating temperature range and voltage requirements for system compatibility. Verify package dimensions against PCB layout constraints. Evaluate interface protocol support for seamless integration into existing designs.
Part Context
This component belongs to NXP's thermal management product line, specifically focusing on board-mount temperature sensors. It is engineered for environments where accurate temperature data is critical for system stability and performance protection.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Due to the obsolete status, consult manufacturer resources for potential cross-references or next-generation replacements.
