SFEM032GB1EA1TO-I-HG-12P-STD

Memory IC Overview

The Swissbit SFEM032GB1EA1TO-I-HG-12P-STD is an industrial eMMC memory module from the EM-26 series. It features a 32 GB capacity using pSLC NAND flash technology and operates within a -40°C to +85°C temperature range. The device complies with JEDEC eMMC 5.0 standards, utilizing a 153-ball BGA package with a 0.5mm pitch measuring 13 x 11.5 mm. It supports HS400 High Speed Mode with clock frequencies up to 200MHz, delivering sequential read speeds of up to 270 MB/s and sequential write speeds of up to 160 MB/s.

Memory IC Feature Summary

• Compliant with JEDEC eMMC 5.0 standard featuring Enhanced Mode (pSLC) for superior endurance
• Supports eleven-wire bus architecture including Data Strobe and hardware reset
• Includes optimized firmware algorithms for power-fail protection and wear leveling
• Provides diagnostic features such as Device Health Report and field firmware updates

Memory IC Applications

• Point of Sale (POS) and Point of Interaction (POI) systems
• Programmable Logic Controllers (PLC)
• Internet of Things (IoT) devices
• Medical equipment
• General boot medium for embedded applications

Memory IC Procurement Notes

Verify the specific ordering suffix against official documentation to confirm exact configuration details. Confirm availability status as industrial components may have limited supply or end-of-life notifications. Ensure compatibility with host controller requirements for voltage levels and interface modes before procurement.

Memory IC Selection Notes

Select this component for applications requiring high reliability and extended data retention in harsh environments. The pSLC configuration offers better write performance and endurance compared to standard MLC options. Verify that the host system supports the required voltage ranges and eMMC 5.0 specifications for optimal operation.

Memory IC Part Context

This part belongs to the Swissbit EM-26 series of industrial eMMC memory modules. The series is designed for embedded markets requiring long life cycles and superior data safety. It utilizes sophisticated firmware architecture to ensure high reliability across various industrial and commercial applications.

Memory IC Replacement Considerations

Direct replacements must match the 153-ball BGA footprint and eMMC 5.0 interface. Consider other densities within the EM-26 series if capacity requirements differ. Verify thermal characteristics and voltage compatibility when substituting with similar industrial-grade eMMC products.