SFEM040GB2ED1TO-I-7G-11P-STD

Memory IC Overview

The Swissbit SFEM040GB2ED1TO-I-7G-11P-STD is an industrial-grade Embedded MMC (eMMC) memory device belonging to the EM-30 series. It provides a storage capacity of 40 GB utilizing 3D TLC flash technology. The component operates within an extended temperature range from -40°C to +105°C and features an eMMC 5.1 interface. It is housed in a BGA-153 package with dimensions of 13 mm x 11.5 mm x 1.2 mm, designed for surface mount installation.

Memory IC Feature Summary

• Supports data-safe in-field firmware updates via proprietary mechanisms
• Includes Lifetime Monitor data accessible through standard eMMC commands
• Engineered for industrial reliability with extended temperature tolerance

Memory IC Applications

• Industrial embedded systems requiring robust data retention
• Automotive electronic control units
• Harsh environment IoT devices

Memory IC Procurement Notes

Verify the specific suffix codes against official Swissbit documentation to confirm exact configuration details. Ensure compatibility with host controller interfaces supporting eMMC 5.1 standards. Confirm that the BGA-153 footprint matches the target PCB design constraints before finalizing procurement decisions.

Memory IC Selection Notes

Select this model when industrial grade performance and wide operating temperatures are required. The 40 GB capacity suits applications needing moderate storage density. Consider the BGA-153 package size for space-constrained designs. Validate firmware update capabilities if long-term field maintenance is anticipated.

Memory IC Part Context

This component is part of the Swissbit EM-30 series, which focuses on industrial and automotive applications. The series emphasizes durability and advanced features like lifetime monitoring. It complements other Swissbit storage solutions by offering reliable NAND flash performance in compact form factors suitable for embedded integration.

Memory IC Replacement Considerations

Check for direct substitutes within the EM-30 series with different capacities or configurations. Verify pin-to-pin compatibility with existing BGA-153 footprints. Ensure any replacement maintains the same eMMC 5.1 interface and industrial temperature ratings.