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SFEM064GB1ED1TO-I-6F-111-STD is listed in the Memory IC range at ChipApex. The manufacturer field lists Swissbit. Its product description is IC FLASH 512GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for SFEM064GB1ED1TO-I-6F-111-STD
- Description：IC FLASH 512GBIT EMMC 153BGA
- Series：EM-30
- Mfr：Swissbit
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND
- Memory Size：512Gbit
- Memory Organization：64G x 8
- Memory Interface：eMMC
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-TFBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for SFEM064GB1ED1TO-I-6F-111-STD
Memory IC Overview
The Swissbit SFEM064GB1ED1TO-I-6F-111-STD is an industrial Embedded MultiMediaCard (eMMC) from the EM-30 series. It features a 64 GB storage capacity utilizing 3D TLC flash memory technology. The component supports the JEDEC eMMC 5.1 interface standard and is housed in a BGA-153 package with dimensions of 13 mm x 11.5 mm x 1.2 mm. It operates within an extended industrial temperature range of -40°C to +85°C.
Memory IC Feature Summary
- Industrial-grade reliability designed for demanding environments
- Supports high-performance 3D TLC NAND flash technology
- Compliant with JEDEC eMMC 5.1 interface specifications
Memory IC Applications
- Industrial automation systems
- Embedded control units
- IoT edge devices
Memory IC Procurement Notes
Verify the specific suffix '6F' against official Swissbit documentation to confirm pinout and marking configurations. Ensure compatibility with host controllers supporting eMMC 5.1 standards. Confirm that the BGA-153 package dimensions align with the target PCB footprint requirements before integration.
Memory IC Selection Notes
Select this model when a 64 GB capacity is required alongside robust thermal stability for industrial applications. The EM-30 series offers a balance of performance and endurance suitable for embedded data logging. Consider the BGA-153 form factor for space-constrained designs requiring reliable solder joint integrity under thermal cycling.
Memory IC Part Context
This component belongs to the Swissbit EM-30 series, which targets industrial and automotive sectors. The series emphasizes long-term availability and consistent performance across varying environmental conditions. The EM-30 line utilizes advanced 3D NAND technology to enhance density and durability compared to previous generations.
Memory IC Replacement Considerations
Direct substitutes are not explicitly confirmed in public documentation. Evaluate other Swissbit EM-30 variants with matching BGA-153 packages and eMMC 5.1 interfaces. Verify electrical and mechanical compatibility before considering alternative part numbers.
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