Memory IC SFEM064GB2ED1TO-A-6F-111-STD product image

SFEM064GB2ED1TO-A-6F-111-STD

$21.17
  • Description:IC FLASH 512GBIT EMMC 153BGA
  • Series:EM-30
  • Mfr:Swissbit
  • Package:Tray

SKU:f1f3ba781ffd Category: Brand:

  
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SFEM064GB2ED1TO-A-6F-111-STD is listed in the Memory IC range at ChipApex. The manufacturer field lists Swissbit. Its product description is IC FLASH 512GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for SFEM064GB2ED1TO-A-6F-111-STD

  • Description:IC FLASH 512GBIT EMMC 153BGA
  • Series:EM-30
  • Mfr:Swissbit
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (TLC)
  • Memory Size:512Gbit
  • Memory Organization:64G x 8
  • Memory Interface:eMMC
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 105°C
  • Mounting Type:Surface Mount
  • Package / Case:153-TFBGA
  • Supplier Device Package:153-BGA (11.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for SFEM064GB2ED1TO-A-6F-111-STD

SFEM064GB2ED1TO-A-6F-111-STD

Memory IC Overview

The Swissbit SFEM064GB2ED1TO-A-6F-111-STD is an industrial Embedded MMC (eMMC) memory device from the EM-30 series. It features a 64 GB storage capacity utilizing 3D TLC flash technology and supports the JEDEC eMMC 5.1 interface standard. The component operates within an extended temperature range of -40°C to +105°C, ensuring reliability in demanding environments. It is housed in a BGA-153 package with dimensions of 13 mm x 11.5 mm x 1.2 mm. The device requires a supply voltage between 2.7 V and 3.6 V.

Memory IC Feature Summary

  • Industrial-grade durability designed for harsh operating conditions
  • High-density 3D NAND flash architecture for reliable data retention
  • Extended thermal stability suitable for automotive and industrial sectors

Memory IC Applications

  • Automotive infotainment systems
  • Industrial control units
  • Embedded computing devices

Memory IC Procurement Notes

Verify the specific suffix codes against official Swissbit documentation to confirm exact performance characteristics and compliance status. Ensure compatibility with host controller interfaces supporting eMMC 5.1 standards. Confirm that the BGA-153 footprint matches the target PCB design constraints. Validate that the operating temperature range aligns with the final application environment requirements before procurement.

Memory IC Selection Notes

Select this model when high-capacity storage is required alongside robust industrial temperature ratings. The 3D TLC configuration offers a balance between cost-efficiency and endurance for general-purpose embedded applications. Consider the BGA-153 package size relative to available board space. Ensure the host system supports the necessary voltage levels and eMMC protocol versions for seamless integration.

Memory IC Part Context

This component belongs to the Swissbit EM-30 series, which focuses on providing reliable storage solutions for industrial and automotive markets. The series emphasizes long-term availability and consistent performance under extreme environmental stress. The EM-30 line utilizes advanced 3D NAND technology to enhance density and reliability compared to previous generations.

Memory IC Replacement Considerations

Direct substitutes include other Swissbit EM-30 series parts with matching pinouts and capacities, such as the SFEM064GB2ED1TB-A-CE-121-STD, provided the package and electrical specifications are identical. Verify cross-compatibility with existing firmware and hardware designs before substitution.

SFEM064GB2ED1TO-A-6F-111-STDSFEM064GB2ED1TO-A-6F-111-STD
$21.17
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