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SFEM064GB2ED1TO-I-6F-111-STD is listed in the Memory IC range at ChipApex. The manufacturer field lists Swissbit. Its product description is IC FLASH 512GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for SFEM064GB2ED1TO-I-6F-111-STD
- Description：IC FLASH 512GBIT EMMC 153BGA
- Series：EM-30
- Mfr：Swissbit
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (TLC)
- Memory Size：512Gbit
- Memory Organization：64G x 8
- Memory Interface：eMMC
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-TFBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for SFEM064GB2ED1TO-I-6F-111-STD
Memory IC Overview
The Swissbit SFEM064GB2ED1TO-I-6F-111-STD is an industrial-grade Embedded MultiMediaCard (eMMC) from the EM-30 series, featuring a BGA-153 package. It provides 64 GB of storage using 3D TLC flash technology and supports the JEDEC e.MMC 5.1 interface. The device operates within a voltage range of 2.7 V to 3.6 V and delivers sequential read speeds of 300 MB/s and write speeds of 230 MB/s. It is designed for harsh environments with a wide operating temperature range of -40°C to +85°C.
Memory IC Feature Summary
- Industrial-grade reliability optimized for demanding operational conditions
- Integrated flash translation layer for robust data management
- Supports high-speed data transfer via e.MMC 5.1 standard
Memory IC Applications
- Industrial automation controllers
- Automotive infotainment systems
- Medical imaging devices
Memory IC Procurement Notes
Verify the specific suffix codes against official Swissbit documentation to confirm exact thermal and electrical specifications. Ensure compatibility with host controller interfaces supporting e.MMC 5.1 standards. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly to maintain component integrity during manufacturing processes.
Memory IC Selection Notes
Select this component when high endurance and wide temperature tolerance are required in compact embedded designs. The BGA-153 footprint suits space-constrained applications. Consider the 3D TLC configuration for balanced cost-performance ratios in high-capacity industrial storage needs compared to MLC alternatives.
Memory IC Part Context
This part belongs to the Swissbit EM-30 series, which focuses on industrial embedded storage solutions. The series emphasizes data protection and sustained performance under extreme environmental stress. It complements other Swissbit memory products like SD cards and SSDs by providing reliable onboard storage for complex electronic systems.
Memory IC Replacement Considerations
Direct substitutes include other Swissbit EM-30 series parts with matching capacity and package, such as SFEM064GB2ED1TB-A-CE-121-STD, provided temperature ranges align with application requirements.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
