SFEM256GB1ED1TO-I-8H-111-STD

Memory IC Overview

The Swissbit SFEM256GB1ED1TO-I-8H-111-STD is an industrial Embedded MultiMediaCard (eMMC) from the EM-30 series. It features a 256 GB storage capacity utilizing 3D TLC NAND flash technology. The device operates within an extended temperature range of -40°C to +85°C and supports the eMMC 5.1 interface standard. Key performance metrics include sequential read speeds up to 300 MB/s and sequential write speeds up to 230 MB/s. The component is housed in a compact BGA package with dimensions of 13 mm x 11.5 mm x 1.2 mm, designed for surface mount applications.

Memory IC Feature Summary

• Built-in wear leveling function for enhanced data integrity
• Power-down data protection mechanism
• Hardware reset capability

Memory IC Applications

• Industrial embedded systems requiring high reliability
• Automotive infotainment and control units
• Medical devices demanding stable storage performance

Memory IC Procurement Notes

Verify the specific ordering suffix against the official Swissbit datasheet to ensure compatibility with your system requirements. Confirm that the 3D TLC configuration meets your endurance needs. Check for any regional distribution restrictions or lead time variations directly with authorized suppliers before finalizing procurement plans.

Memory IC Selection Notes

Select this model when high-density storage is required alongside robust industrial-grade temperature tolerance. The eMMC 5.1 interface ensures broad compatibility with modern host controllers. Consider the 3D TLC architecture for cost-effective high-capacity solutions where moderate endurance levels are acceptable compared to SLC alternatives.

Memory IC Part Context

This component belongs to the Swissbit EM-30 series, which focuses on industrial-grade embedded memory solutions. The series is characterized by its compliance with JEDEC standards and availability in various form factors suitable for space-constrained electronic designs. It represents a balance between high storage density and operational reliability in harsh environments.

Memory IC Replacement Considerations

Direct replacements must match the BGA-153 package and eMMC 5.1 interface. Verify thermal specifications and voltage requirements. Cross-reference part numbers within the Swissbit portfolio for equivalent capacities or alternative NAND types if exact matches are unavailable.