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SFEM256GB2ED1TB-A-VG-111-STD is listed in the Memory IC range at ChipApex. The manufacturer field lists Swissbit. Its product description is IC FLASH 2TBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for SFEM256GB2ED1TB-A-VG-111-STD
- Description：IC FLASH 2TBIT EMMC 153BGA
- Series：EM-30
- Mfr：Swissbit
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (TLC)
- Memory Size：2Tbit
- Memory Organization：256G x 8
- Memory Interface：eMMC
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 105°C
- Mounting Type：Surface Mount
- Package / Case：153-TFBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for SFEM256GB2ED1TB-A-VG-111-STD
Memory IC Overview
The Swissbit SFEM256GB2ED1TB-A-VG-111-STD is an industrial-grade embedded multimedia card (eMMC) based on the EM-30 series. It utilizes 3D TLC NAND flash technology with a storage capacity of 256 GB (2Tb). The device operates within a temperature range of -40°C to +105°C and supports the JEDEC e.MMC 5.1 standard. It features a 153-ball BGA package measuring 11.5 mm x 13 mm, designed for surface mount installation in compact embedded systems.
Memory IC Feature Summary
- Supports automatic background data refresh for read-only areas to ensure long-term data retention under high temperatures.
- Provides enhanced protection against data corruption during sudden power loss events.
- Allows access to device health details such as write cycles via standard e.MMC register access.
Memory IC Applications
- Automotive infotainment and ADAS systems
- Industrial PLCs and automation controllers
- Medical system data storage
- IoT edge devices
Memory IC Procurement Notes
Verify the specific suffix code against official documentation to confirm exact configuration. Ensure compatibility with host controller e.MMC 5.1 interfaces. Confirm thermal management requirements for the specified operating temperature range. Check for AEC-Q100 certification if automotive application is intended.
Memory IC Selection Notes
Select this component for applications requiring high-density storage in extreme environments. The 153-BGA form factor suits space-constrained designs. Consider the 3D TLC architecture for cost-effective high-capacity needs while maintaining industrial reliability standards.
Memory IC Part Context
This part belongs to the Swissbit EM-30 series, which offers industrial and automotive-grade embedded storage solutions. The series is characterized by its robustness, small footprint, and support for advanced data integrity features suitable for critical embedded applications.
Memory IC Replacement Considerations
Direct substitutes include other Swissbit EM-30 series variants with matching capacity and interface. Verify pinout and firmware compatibility before replacing existing components in production designs.
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