SFH608-3X007T

Overview

The SFH608-3X007T is a single-channel optocoupler featuring an infrared LED and a phototransistor with base output in a 6-SMD package. It provides 5300Vrms isolation voltage. The device operates with a forward current up to 50 mA and supports a collector current of 50 mA. Key electrical parameters include a typical forward voltage of 1.1 V, maximum collector-emitter voltage of 55 V, and saturation voltage of 400 mV. Current transfer ratio ranges from 100% to 200% at 1 mA input. Switching times are typically 8 µs (turn-on) and 7.5 µs (turn-off). Operating temperature spans -55°C to 100°C.

Feature Summary

• Integrates infrared LED and phototransistor with base for high current transfer ratio at low input currents.
• Provides robust electrical isolation with 5300Vrms insulation voltage between input and output circuits.
• Designed for digital logic transmission, impedance transformation, and system-to-system electrical insulation.

Applications

• Digital logic signal transmission and level shifting
• Power supply control and switching circuits
• Electrical isolation between circuits and systems

Procurement Notes

Verify the specific suffix X007T corresponds to the 6-SMD reel packaging configuration when ordering. Confirm that the 5300Vrms isolation rating meets safety standards for the target application environment. Ensure the 50 mA collector current limit is sufficient for the load requirements. Check RoHS compliance status if restricted substances are a concern for the manufacturing process.

Selection Notes

Select this component when high current transfer efficiency at low drive currents is required compared to standard phototransistor outputs. The integrated base allows for faster switching and better linearity than basic configurations. Consider the 6-SMD footprint constraints and the 55V output voltage limit. Evaluate the 8µs switching speed against system timing requirements before choosing over faster logic gate isolators.

Part Context

This part belongs to Vishay's SFH608 series of transistor-output optocouplers. It shares the core die characteristics with through-hole variants like SFH608-5 but differs in package style and termination method. The series is designed for general-purpose isolation applications requiring reliable performance across wide temperature ranges.

Replacement Considerations

Direct pin-compatible replacements may require verification of package dimensions and electrical parameters. Consult manufacturer cross-reference guides for equivalent SMD packages with similar isolation voltages and current transfer ratios.