SFH618A-2SM

Overview

The SFH618A-2SM is a surface-mount transistor output optocoupler from Isocom Components. It integrates an infrared LED with an NPN silicon phototransistor in a compact 4-SMD package. Key electrical specifications include a high isolation voltage of 5300Vrms and a peak value of 7.5kV. The device features a low input current requirement of 0.5mA and offers high current transfer ratios ranging from 63% to 320% at 1mA, with a minimum of 32% at 0.5mA. The output collector-emitter breakdown voltage (BVCEO) is rated at a minimum of 55V.

Feature Summary

• Low input current operation requiring only 0.5mA for activation
• High isolation voltage capability of 5.3kV RMS for robust signal transmission between different potentials
• High current transfer ratio ensuring efficient signal coupling at low drive currents
• Space-efficient dual in-line plastic surface mount packaging

Applications

• Computer terminals
• Industrial systems controllers
• Measuring instruments
• Signal transmission between systems of different potentials and impedances

Procurement Notes

Verify the specific ordering suffix to confirm the package type and handling format. The 'SM' suffix indicates a surface mount configuration. Ensure compliance with RoHS standards if required by the application. Confirm that the component meets UL recognition File No. E91231 requirements for safety approvals. Check for VDE 0884 approval status as this may be pending depending on the specific production batch or variant.

Selection Notes

Select this component when space constraints require a surface mount solution for optoisolation. It is suitable for applications demanding high isolation voltages with low input drive currents. Consider the current transfer ratio range when designing circuits for varying temperature conditions. Ensure the PCB layout supports the 4-SMD footprint and maintains adequate creepage distances for the 5.3kV isolation rating.

Part Context

This part belongs to the SFH618A series of low input current phototransistor optically coupled isolators. The series includes variants with DIP packages (suffix G), tape and reel options (suffix SMT&R), and different lead spreads. All members share the core architecture of an infrared LED paired with an NPN silicon phototransistor, offering 100% tested electrical parameters for consistency across the family.

Replacement Considerations

Direct substitutes within the same series include SFH618A-2SMT&R for tape and reel packaging or SFH618A-2-G for through-hole DIP mounting. These parts share identical electrical characteristics but differ in physical package and handling method. Verify pin compatibility and thermal performance when transitioning between package types.