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SFH6750-X007T is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Vishay Semiconductor Opto Division. Its product description is OPTOISO 5.3KV 2CH OPEN DRN 8-SMD. Review the specifications below when checking this part for your BOM.
The SFH6750-X007T is a dual-channel high-speed optocoupler manufactured by Vishay Semiconductor Opto Division. It features an open-drain output configuration and supports data rates up to 10 MBd. The device provides 5300 Vrms isolation voltage and exhibits a common-mode transient immunity of 100 V/µs. Electrical characteristics include a maximum forward current of 15 mA, typical forward voltage of 1.4 V, and output current per channel of 50 mA. Propagation delays are typically 100 ns for both low-to-high and high-to-low transitions, with rise and fall times of 23 ns and 7 ns respectively. It operates within a temperature range of -40°C to +100°C.
Verify the specific suffix designation against official manufacturer documentation to confirm pinout compatibility and electrical specifications. Confirm RoHS compliance status and moisture sensitivity level requirements prior to integration into surface-mount assembly processes. Ensure thermal management strategies align with the specified operating temperature range and power dissipation limits defined in the component datasheet.
Select this component when dual-channel isolation is required alongside high-speed digital signal transmission capabilities. The open-drain output necessitates external pull-up resistors for proper logic level interfacing. Evaluate the 5300 Vrms isolation rating against system safety standards and ensure the 100 V/µs CMTI meets the electromagnetic interference environment requirements of the target application design.
This part belongs to the SFH6750 family of high-speed optocouplers from Vishay. It utilizes an LED input paired with a photodiode receiver architecture to achieve fast switching speeds compared to standard transistor-output devices. The SMD-8 package facilitates compact printed circuit board layouts for modern electronic designs requiring dense component placement.
Publicly confirmed substitute part numbers are not available in the provided source material.
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