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SG-9101CG-D10SGCAB is listed in the Programmable Oscillators range at ChipApex. The manufacturer field lists EPSON. Its product description is XTAL OSC PROG XO CMOS DWN SPRD. Review the specifications below when checking this part for your BOM.
The SG-9101CG-D10SGCAB is a programmable spread spectrum crystal oscillator (XO) manufactured by EPSON. It features CMOS output and operates within a supply voltage range of 1.62V to 3.63V. The device supports a frequency range of 670 kHz to 170 MHz and includes a standby function with a maximum disabled current of 3.7 mA. It utilizes a crystal resonator and is housed in a 4-SMD, no-lead package measuring 2.50mm x 2.00mm x 0.80mm. The unit is rated for operation between -40°C and 105°C and offers a downward spread bandwidth of -1.00%.
Verify that the specific ordering suffix matches the required frequency and package configuration. Confirm that the supplier provides official documentation from EPSON. Ensure the component meets RoHS3 compliance requirements for your assembly process. Check for moisture sensitivity level 1 handling instructions during storage and reflow soldering procedures.
Select this component when a small surface-mount footprint is required alongside programmable frequency options. Consider the CMOS output drive strength relative to load capacitance requirements. Evaluate the thermal performance within the -40°C to 105°C operating range for your specific environmental conditions. Ensure the supply voltage remains within the 1.62V to 3.63V limits during all operational states.
This model belongs to the SG-9101 series of programmable spread spectrum crystal oscillators. The series is designed to provide flexible clock solutions for modern electronics. The SG-9101CG variant specifically denotes the commercial grade temperature range and package type. This family emphasizes compact size and low noise performance for signal integrity.
Direct substitutes include other SG-9101CG variants with compatible pinouts and electrical specifications. Verify frequency compatibility and output logic levels before substitution. Cross-reference package dimensions to ensure mechanical fit in existing footprints.
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