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Product Detailed Parameters
- Description：TRANS 8NPN DARL 50V 500MA 18CDIP
- Series：-
- Mfr：Microchip Technology
- Package：Tube
- Transistor Type：8 NPN Darlington
- Current - Collector (Ic) (Max)：500mA
- Voltage - Collector Emitter Breakdown (Max)：50V
- Vce Saturation (Max) @ Ib, Ic：1.6V @ 500µA, 350mA
- Current - Collector Cutoff (Max)：-
- DC Current Gain (hFE) (Min) @ Ic, Vce：1000 @ 350mA, 2V
- Power - Max：-
- Frequency - Transition：-
- Operating Temperature：-55°C ~ 125°C (TA)
- Mounting Type：Through Hole
- Package / Case：-
- Supplier Device Package：18-CDIP
- Grade：-
- Qualification：-
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Overview
The SG2803J-883B is a high-reliability NPN Darlington transistor array manufactured by Microchip Technology. It features seven independent drivers configured in an array format, housed in a CDIP-18 package designed for through-hole mounting. The device supports a maximum collector-emitter voltage of 50 V and provides a maximum DC collector current of 500 mA per channel. It exhibits a minimum DC current gain (hFE) of 1000 and utilizes open-collector outputs. The component operates within a temperature range from -55°C to +125°C.
Feature Summary
- High-reliability construction suitable for demanding environments
- Seven-channel Darlington configuration for medium-current driving
- Open-collector output topology for flexible interfacing
Applications
- Industrial control systems requiring robust switching
- Military and aerospace electronic assemblies
- High-reliability relay driver circuits
Procurement Notes
Verify the specific suffix designation with the manufacturer or authorized distributor to confirm compliance with MIL-PRF-38534 or equivalent high-reliability standards. Ensure that the ordering information matches the exact thermal and mechanical specifications required for the target application environment before finalizing procurement.
Selection Notes
Select this component when a multi-channel NPN Darlington array with high current gain and wide operating temperature range is required. Confirm that the 50 V voltage rating and 500 mA current capacity align with the load requirements. Verify that the CDIP-18 through-hole package is compatible with the printed circuit board layout and assembly processes.
Part Context
This part belongs to Microchip's portfolio of high-reliability semiconductor devices, often intended for defense and space applications. It serves as a discrete solution for driving loads where integrated circuits may not meet radiation tolerance or long-term stability requirements found in specialized military specifications.
Replacement Considerations
Direct replacements include the SG2803L-883B, which offers identical electrical characteristics but utilizes a CLCC-20 surface-mount package instead of the through-hole CDIP-18 configuration.
