Clock Buffers, Drivers SI5330H-A00220-GM product image

SI5330H-A00220-GM

  • Description:IC CLK BUFFER 1:8 350MHZ 24QFN
  • Series:-

SKU:61fbc67d3140 Category: Brand:

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SI5330H-A00220-GM is listed in the Clock Buffers, Drivers range at ChipApex. The manufacturer field lists Skyworks Solutions Inc.. Its product description is IC CLK BUFFER 1:8 350MHZ 24QFN. Review the specifications below when checking this part for your BOM.

Clock Buffers, Drivers specifications for SI5330H-A00220-GM

  • Description:IC CLK BUFFER 1:8 350MHZ 24QFN
  • Series:-
  • Package:Tray
  • Mfr:Skyworks Solutions Inc.
  • Type:Fanout Buffer (Distribution), Translator
  • Number of Circuits:1
  • Ratio - Input:Output:1:08
  • Differential - Input:Output:Yes/No
  • Input:CML, HCSL, LVDS, LVPECL
  • Output:SSTL
  • Frequency - Max:350 MHz
  • Voltage - Supply:1.71V ~ 3.63V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:24-VFQFN Exposed Pad
  • Supplier Device Package:24-QFN (4x4)
  • Grade:-
  • Qualification:-

Clock Buffers, Drivers datasheet and documents for SI5330H-A00220-GM

SI5330H-A00220-GM

Clock Buffers, Drivers Overview

The SI5330H-A00220-GM is a low-jitter, low-skew clock buffer and level translator manufactured by Silicon Laboratories. It accepts differential input signals and generates eight single-ended SSTL outputs. The device operates with a core supply voltage of 1.8 V, 2.5 V, or 3.3 V, while the output driver supply (VDDO) is set to 3.3 V for SSTL compatibility. It supports frequency ranges from 5 MHz to 350 MHz, features an additive jitter of 150 fs RMS typical, and includes a Loss of Signal (LOS) indicator and glitchless Output Enable (OEB) control.

Clock Buffers, Drivers Feature Summary

  • Generates eight single-ended SSTL outputs from a differential input
  • Additive phase jitter: 150 fs RMS typical (12 kHz–20 MHz)
  • Output-output skew: 100 ps maximum
  • Propagation delay: 2.5 ns typical

Clock Buffers, Drivers Applications

  • High Speed Clock Distribution
  • Ethernet Switch/Router
  • SONET / SDH
  • PCI Express 2.0/3.0
  • Fibre Channel

Clock Buffers, Drivers Procurement Notes

Verify that the ordering suffix matches the required shipment media; adding 'R' specifies tape and reel packaging. Confirm the specific output format configuration code corresponds to the 3.3 V SSTL variant. Ensure the central ground pad is properly connected to the system ground plane during assembly to maintain specified performance.

Clock Buffers, Drivers Selection Notes

Select this part when eight single-ended SSTL outputs are required from a differential source. The core supply can be optimized for power consumption at 1.8 V, 2.5 V, or 3.3 V, independent of the 3.3 V output driver supply. Verify that the input signal frequency falls within the 5 MHz to 350 MHz range for SSTL operation.

Clock Buffers, Drivers Part Context

This component belongs to the Si5330 family of low-jitter clock buffers. The 'H' designation indicates a differential-to-single-ended buffer configuration. Other variants in the series support LVPECL, LVDS, HCSL, CMOS, and HSTL formats with varying input types.

Clock Buffers, Drivers Replacement Considerations

Other Si5330 variants such as SI5330G-A00219-GM provide similar functionality but with different output voltage levels or signal formats. Direct substitution requires matching the output drive strength and voltage requirements of the downstream circuitry.

Clock Buffers, Drivers FAQ

What is the function of the LOS pin?

The LOS pin is an open-drain output that indicates the status of the input clock. It asserts low when a valid clock signal is present and goes high when a loss of signal is detected.

How is the OEB pin controlled?

The Output Enable (OEB) pin allows glitchless control of the output clocks. Connecting it to ground enables all outputs, while connecting it to VDD disables them, forcing outputs to a logic low state.

What is the recommended PCB layout for the ground pad?

The center ground pad must be tied to the system ground using no less than five vias to a ground plane located no more than 20 mils below to ensure proper thermal dissipation and electrical performance.

SI5330H-A00220-GMSI5330H-A00220-GM

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