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SI823H6AB-IM1 is listed in the Isolators - Gate Drivers range at ChipApex. The manufacturer field lists Skyworks Solutions Inc.. Its product description is 5KV GATE DRIVER 14-QFN. Review the specifications below when checking this part for your BOM.
The SI823H6AB-IM1 is a dual-channel isolated gate driver from the Skyworks Si823Hx series, housed in a QFN-14 package. It provides galvanic isolation with a rated voltage of 2.5 kV and incorporates a 5 V undervoltage lockout (UVLO) mechanism for both high-side and low-side channels. The device operates on a supply voltage range of 3 V to 5.5 V and supports an operating temperature range from -40 °C to +125 °C. It is AEC-Q100 qualified for automotive applications.
Verify the specific suffix 'IM1' to confirm the QFN-14 package variant, as other suffixes indicate different packages like SOIC or tube packaging. Ensure the procurement channel sources genuine Skyworks components to maintain AEC-Q100 compliance. Check for moisture sensitivity levels and recommended reflow profiles during assembly planning.
Select this component when a dual-channel solution with integrated UVLO is required for high-reliability applications. The QFN-14 package offers a compact footprint suitable for space-constrained designs. Consider the 2.5 kV isolation rating against system voltage requirements and ensure thermal management aligns with the +125 °C maximum junction temperature specification.
This part belongs to the Si823Hx family of isolated gate drivers, which utilizes silicon dioxide (SiO2) isolation technology. The family includes variants with different pin counts and isolation ratings, such as the SI823H6AD-IS3 (SOIC-14, 5 kV). The SI823H6AB-IM1 specifically targets applications needing dual-channel control with automotive qualification in a small form factor.
Direct substitutes within the same family include SI823H6AB-IM (SOIC-16) or SI823H6AB-IS1 (SOIC-16), though package differences require PCB layout adjustments. For higher isolation needs, consider the SI823H9xx series. Verify pin compatibility before swapping between SOIC and QFN packages.
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