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SI8631EC-B-IS1 is listed in the Digital Isolators range at ChipApex. The manufacturer field lists Skyworks Solutions Inc.. Its product description is DGTL ISOLTR 3.75KV 3CH GP 16SOIC. Review the specifications below when checking this part for your BOM.
The SI8631EC-B-IS1 is a Skyworks digital isolator featuring three channels with two forward and one reverse polarity configuration. It utilizes capacitive coupling technology to provide an insulation voltage of 3750 Vrms. The device supports data rates up to 150 Mb/s with a propagation delay of 8 ns. It operates within a supply voltage range of 2.5 V to 5.5 V and functions across a temperature range of -40°C to +125°C. Packaged in a 16-pin SOIC-Narrow, it holds AEC-Q100 qualification for automotive applications.
Verify the specific suffix 'IS1' corresponds to the SOIC-Narrow-16 package and reel packaging format as indicated by distributor specifications. Confirm that the EC variant meets the required 3750 Vrms insulation rating for your safety isolation design. Ensure compatibility with the si86xxiso-kit development resources if prototyping is planned.
Select this component when high-speed data transmission at 150 Mb/s is required alongside robust galvanic isolation. The unidirectional channel configuration suits applications where signal flow is strictly source-to-destination. Consider the wide operating temperature range and low propagation delay for timing-critical industrial or automotive environments requiring reliable digital communication.
This part belongs to the si863x series of digital isolators from Skyworks Solutions. It shares the same family architecture as other variants like the SI8631AB but differs in insulation voltage and speed specifications. The series is designed to replace optocouplers in modern electronic designs, offering higher performance and smaller form factors.
The SI8631BB-B-IS serves as a functional substitute within the same series, though it features a wider SOIC package and lower insulation voltage. Verify pinout compatibility and thermal dissipation requirements when transitioning between narrow and wide packages.
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