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SI86S640FE-IS2 is listed in the Digital Isolators range at ChipApex. The manufacturer field lists Skyworks Solutions Inc.. Its product description is DGTL ISOLTR 6KV 4CH GP 16-SOIC. Review the specifications below when checking this part for your BOM.
The SI86S640FE-IS2 is a Skyworks Solutions automotive-grade digital isolator featuring four unidirectional channels with up to 6.0 kVrms isolation capability. It utilizes capacitive coupling technology and operates within a wide supply voltage range of 2.25 V to 5.5 V. The device supports data rates from DC to 150 Mbps and offers high common-mode transient immunity. Packaged in a 16-SOIC format, it requires no start-up initialization, making it suitable for robust industrial and automotive signal isolation applications.
Verify that the specific suffix FE-IS2 matches the required package type and tape-and-reel configuration for your assembly line. Confirm that the 6.0 kVrms isolation rating aligns with your system's safety standards and regulatory requirements. Ensure compatibility with the specified 2.25 V to 5.5 V supply voltage range during design validation.
Select this component when high isolation voltage and high-speed data transfer are critical. It is ideal for designs requiring four isolated channels in a compact SOIC package. Consider its automotive-grade reliability for harsh environments. Compare against lower isolation variants if voltage stress is minimal, or higher speed options if data rates exceed 150 Mbps.
This part belongs to the Si86S6x series of automotive digital isolators from Skyworks Solutions. It complements other family members like the SI86S640BC-AS1R by offering higher isolation ratings. The series focuses on providing reliable signal separation in noisy electrical environments while maintaining small form factors for modern PCB layouts.
Direct substitutes include the SI86S640FE-IS2R (reel variant) and SI86S640EE-IS2 (tube packaging). Verify pinout compatibility and isolation voltage ratings before swapping. Ensure thermal performance and package dimensions match the existing footprint.
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