SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The SIL2623A-TP is a dual P-channel MOSFET array manufactured by Micro Commercial Components. It utilizes Trench LV technology and is housed in an SOT-23-6L surface-mount package. The device supports a drain-source voltage of -30V and a continuous drain current of -3A at 25°C. Key electrical parameters include a maximum on-resistance of 90mΩ at VGS=-10V and ID=-3A, with a gate threshold voltage ranging from -1.0V to -2.5V. Total power dissipation is rated at 1.25W, and the operating junction temperature range spans from -55°C to +150°C.
Verify component authenticity by sourcing exclusively from authorized Micro Commercial Components distributors or direct channels. Confirm RoHS compliance and Halogen-free status through official documentation. Ensure storage conditions adhere to Moisture Sensitivity Level 1 guidelines to prevent package damage prior to soldering. Validate part markings against the provided datasheet specifications.
Select this component for designs requiring a compact dual P-channel solution within an SOT-23-6L footprint. Evaluate thermal constraints carefully as total power dissipation is limited to 1.25W based on junction-to-ambient resistance. Ensure gate drive voltages remain within the ±20V limit while confirming that the required on-resistance meets system efficiency targets at specific current loads.
This device belongs to the SIL2623 series of dual MOSFET arrays produced by Micro Commercial Components. It serves as a specialized discrete semiconductor solution designed for space-constrained printed circuit board layouts. The product line emphasizes high reliability and environmental compliance for modern electronic manufacturing requirements.
Consult official manufacturer substitution guides for verified equivalents. Cross-reference pinout configurations and electrical limits before integrating alternative components into existing designs.
The absolute maximum rating for gate-source voltage is ±20V.
Yes, the internal body diode exhibits a typical reverse recovery time of 12ns and a charge of 4.4nC.
The junction-to-ambient thermal resistance is specified as 100°C/W when mounted on a 1in² FR-4 board with 2oz copper in still air.