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SIM-83+ is listed in the RF Mixers range at ChipApex. The manufacturer field lists Mini-Circuits. Its product description is IC MIX 2.3GHZ-8GHZ UP/DOWN 6SMD. Review the specifications below when checking this part for your BOM.
The SIM-83+ is a wideband surface-mount frequency mixer manufactured by Mini-Circuits. It operates within an RF and LO frequency range of 2.3 GHz to 8 GHz, with an IF frequency extending from DC to 3 GHz. The component requires a local oscillator power level of 7 dBm and exhibits a maximum conversion loss of 8.9 dB. Designed for robust performance, it utilizes InGaP technology and is housed in an 8-SMD, No Lead package. The device supports both up-conversion and down-conversion applications across its specified bandwidth.
Verify the specific ordering suffix against official Mini-Circuits documentation to ensure correct configuration. Confirm that the required LO drive level matches system capabilities. Check RoHS compliance status via the manufacturer's datasheet. Ensure the SMD package dimensions align with PCB layout constraints. Validate thermal management requirements for the intended operating environment.
Select this component when wideband mixing capability between 2.3 GHz and 8 GHz is required. Consider the 8.9 dB maximum conversion loss impact on system noise figure. Evaluate the DC to 3 GHz IF output against downstream filter specifications. Assess the 7 dBm LO power requirement against available driver stages. Verify compatibility with surface-mount assembly processes.
The SIM-83+ belongs to Mini-Circuits' portfolio of MMIC components designed for chip and wire integration or surface-mount applications. This series includes various amplifiers, attenuators, couplers, filters, mixers, multipliers, and splitter/combiners. The product line spans frequencies from DC to mmWave, offering engineers a broad selection of integrated solutions for wireless and RF systems.
Consult Mini-Circuits official substitution guides for verified alternatives. Cross-reference pinout configurations and electrical parameters before swapping. Ensure any substitute part maintains equivalent bandwidth and conversion loss characteristics. Verify package compatibility if physical footprint changes are involved.
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