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SIT8208AC-G1-18S-8.192000Y is listed in the Oscillators range at ChipApex. The manufacturer field lists SiTime. Its product description is MEMS OSC XO 8.1920MHZ LVCM LVTTL. Review the specifications below when checking this part for your BOM.
The SIT8208AC-G1-18S-8.192000Y is a standard clock oscillator from the SiT8208 series, manufactured by SiTime. It utilizes MEMS technology to generate a precise frequency of 8.192 MHz with an output signal type of LVCMOS/LVTTL. The device operates at a supply voltage of 1.8V and supports a standby power-down function for energy efficiency. It features a frequency stability of ±20 ppm and functions within an industrial temperature range of -20°C to +70°C. The component is housed in a compact 4-SMD, No Lead package measuring 2.70mm x 2.40mm.
Verify the specific ordering suffix against the manufacturer's current datasheet to ensure compatibility with required voltage levels and output drive strengths. Confirm that the 1.8V supply requirement aligns with the target system's power architecture. Check for any recent updates to the RoHS compliance status or packaging specifications before finalizing procurement orders.
Select this part when a low-profile, MEMS-based oscillator is required for LVCMOS/LVTTL applications. Ensure the system design accommodates the 1.8V operating voltage and the specified ±20 ppm frequency stability. Consider the standby current consumption if power management during idle states is a critical design constraint for the end application.
This component belongs to the SiT8208 family of silicon MEMS oscillators. These devices are designed to offer high reliability and shock resistance compared to mechanical quartz alternatives. The series provides configurable solutions for various frequencies and packages, supporting diverse timing needs across multiple industries with standardized semiconductor manufacturing processes.
Direct substitutes include other SiT8208 variants with matching 8.192 MHz frequency and 1.8V operation, such as SIT8208AC-G1-18E-8.192000Y, provided the output drive characteristics and package dimensions remain compatible with the existing PCB layout.
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