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SIWG917M141XGTBAR is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists Silicon Labs. Its product description is WI-FI 6 SOC IC, QFN 7X7, 2.4 GHZ. Review the specifications below when checking this part for your BOM.
The SIWG917M141XGTBAR is a Wi-Fi 6 and Bluetooth LE 5.4 System-on-Chip (SoC) manufactured by Silicon Labs, designed for ultra-low power IoT applications. It integrates an ARM Cortex-M4 core operating at up to 180 MHz with 672 kB of SRAM. The device supports 802.11b/g/n/ax protocols and Matter connectivity within the 2.412 GHz to 2.484 GHz frequency range. Key electrical specifications include a maximum data rate of 5 Mbps, -97.5 dBm sensitivity, and a transmit power of 19.5 dBm. Supply voltage ranges from 1.71 V to 3.63 V, with receive currents between 10 mA and 18 mA. It features a 7x7 mm 84-VFQFN package.
Verify the specific suffix 'XGTBAR' corresponds to the tape-and-reel packaging format required for automated surface-mount assembly processes. Confirm that the 84-VFQFN footprint matches the target PCB design guidelines provided in the official datasheet. Ensure compatibility with the 1.71V to 3.63V supply rails during final validation. Cross-reference the latest errata documents for any silicon revisions affecting RF performance or thermal characteristics before mass production deployment.
Select this component when both Wi-Fi 6 and Bluetooth LE 5.4 are required in a single package with Matter support. Choose this part over variants without AI/ML acceleration if edge processing is necessary. Opt for the XGTBAR suffix specifically for reel-based manufacturing workflows. Consider alternative SiWG917 models if external flash memory or different RAM capacities better suit the application constraints.
This SoC belongs to the SiWG917 family, representing Silicon Labs' entry into Wi-Fi 6 enabled wireless microcontrollers. It combines radio transceiver functionality with a high-performance MCU core. The series targets the growing market for connected IoT devices needing standardized protocols like Matter. It serves as a foundational component for next-generation smart building and consumer electronics requiring efficient wireless communication.
Public confirmed substitute part numbers: SIWG917M141XGTBA (Tray packaging variant). Verify pinout and electrical equivalence before substitution.
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