SKY68000-31

Overview

The SKY68000-31 is an LTE dual-band front-end module designed for IoT applications. It operates within frequency ranges of 777 MHz to 787 MHz and 1.71 GHz to 1.755 GHz. The device requires a working supply voltage between 2.85 V and 4.5 V. It utilizes a 24-pin MCM package suitable for SMD/SMT installation. Functional control is managed via a single MIPI interface, which drives the power amplifier in optimized bias modes.

Feature Summary

• Integrated dual-band RF front-end solution tailored for IoT connectivity
• Single MIPI interface enables comprehensive functional control and PA bias optimization
• Compact 24-pin MCM package design facilitates surface-mount integration

Applications

• IoT devices requiring CAT0 compliance
• LTE-enabled smart metering systems
• Industrial wireless sensor networks

Procurement Notes

Verify component status as this part may be discontinued or subject to limited availability. Confirm current manufacturing lifecycle stage through official Skyworks channels before finalizing procurement plans. Ensure compatibility with existing MIPI control interfaces and verify that the 24-MCM package aligns with PCB layout constraints. Check for alternative sourcing options if standard distribution channels report restricted supply conditions.

Selection Notes

Select this module when designing IoT equipment requiring specific LTE band support within the 777-787 MHz and 1.71-1.755 GHz ranges. Ensure the system architecture supports MIPI-based control signals for optimal performance. Consider the 2.85 V to 4.5 V operating voltage range against available power rails. Evaluate the 24-pin MCM footprint against board space limitations and thermal management requirements for the target application environment.

Part Context

This component belongs to the SKY68000 series of RF front-end modules from Skyworks Solutions. It is specifically engineered for low-complexity LTE connectivity in Internet of Things devices. The module integrates necessary amplification and filtering functions into a single compact package, simplifying design complexity compared to discrete solutions while maintaining required signal integrity for IoT communication standards.

Replacement Considerations

Public confirmed substitute part numbers are not provided in the source material.