SKY77824-11

Description：SKY77824-11
Series：-
Mfr：Skyworks Solutions Inc.
Package：Bulk

SKU:ecc0a3724960 Category: RF Misc ICs and Modules Brand: Skyworks Solutions Inc.

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Product introduction

Product Detailed Parameters

Description：SKY77824-11
Series：-
Mfr：Skyworks Solutions Inc.
Package：Bulk
Function：-
Frequency：-
RF Type：-
Secondary Attributes：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Grade：-
Qualification：-

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SKY77824-11

Overview

The SKY77824-11 is a fully matched, 28-pad surface mount Power Amplifier Module (PAM) developed by Skyworks Solutions for LTE applications. It operates within the 2.3GHz to 2.69GHz frequency range, supporting broadband high power efficiency. The module integrates an output RF switch with built-in Time Division Duplex (TDD) transmit/receive switching functionality. It is designed to adapt to Average Power Tracking (APT) technology and features a MIPI RFFE digital control interface for system integration.

Feature Summary

Supports Average Power Tracking (APT) technology
Integrates output RF switch with TDD transmit/receive switching
Features MIPI RFFE digital control interface

Applications

LTE FDD Band 7
LTE FDD Band 30
LTE TDD Band 38
LTE TDD Band 41
LTE TDD Band 40

Procurement Notes

Verify current availability status as the component may be subject to discontinuation or limited supply. Confirm package integrity and authenticity through authorized channels. Check for recent Product Change Notifications regarding manufacturing site or material updates. Ensure compatibility with existing board designs before procurement.

Selection Notes

Select this module for LTE systems requiring integrated PA and switch solutions in compact form factors. Consider its support for APT for improved power efficiency. Verify that the host controller supports the MIPI RFFE interface for digital control. Ensure the application operates within the specified 2.3GHz to 2.69GHz bandwidth.

Part Context

This component belongs to Skyworks' portfolio of RF front-end modules designed for mobile communication devices. It addresses the need for integrated solutions that reduce board space and simplify design complexity for LTE networks. The module combines power amplification with switching capabilities to streamline transmitter chains.