SL 10 SMD 130 31 G

Headers, Male Pins Overview

The SL 10 SMD 130 31 G is a surface mount pin header manufactured by Fischer Elektronik. It features a single row with 31 contacts and a 2.54 mm pitch. The component supports board-to-board and wire-to-board connections. Plating options include nickel with gold or tin finishes, ensuring reliable electrical performance across an operating temperature range of -40°C to +163°C.

Headers, Male Pins Feature Summary

• Surface mount design compatible with pick-and-place assembly processes
• Single row configuration for compact board-to-board interconnects
• Robust plating options including nickel-gold and nickel-tin variants

Headers, Male Pins Applications

• Board-to-board connectivity in dense electronic assemblies
• Wire-to-board connections for modular system integration
• High-density signal routing in industrial control units

Headers, Male Pins Procurement Notes

Verify the specific contact count and plating finish against project requirements. Confirm that the surface mount package aligns with the PCB footprint and reflow profile specifications. Ensure the selected variant matches the required thermal endurance and environmental protection standards for the intended application environment.

Headers, Male Pins Selection Notes

Select this component when a single-row surface mount header with 31 positions is required. Consider the 2.54 mm pitch for standard spacing compatibility. Evaluate the available plating options based on corrosion resistance needs and solderability requirements during the assembly process.

Headers, Male Pins Part Context

This part belongs to the SL 10 SMD 130 series from Fischer Elektronik, designed for high-reliability surface mount applications. The series offers various contact counts and plating configurations to suit different density and environmental demands within electronic hardware designs.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 31-contact count, 2.54 mm pitch, and surface mount straight form factor. Verify mechanical dimensions and plating specifications to ensure functional equivalence without redesigning the host PCB layout.