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SL 11 124 16 S is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is ONE ROW, 0.635 MM. Review the specifications below when checking this part for your BOM.
The SL 11 124 16 S is a male pin header connector manufactured by Fischer Elektronik. It features a single row of contacts with a pitch of 0.635 mm and accommodates 16 positions. The connector utilizes through-hole straight termination for PCB mounting. Contact materials consist of copper alloy, with tin plating on the mating interface to ensure reliable electrical conductivity. The design supports standard board-to-board or wire-to-board interconnections in compact electronic assemblies.
Verify the specific suffix 'S' indicates tin plating rather than gold when sourcing. Confirm the 0.635 mm pitch requirement against the target socket specifications. Ensure the 16-position count matches the circuit design. Check RoHS compliance status if required by project regulations. Validate mechanical dimensions against the official datasheet before finalizing procurement.
Select this component when a low-profile, high-density connection is required. The 0.635 mm pitch allows for tighter spacing compared to standard 2.54 mm headers. Consider the tin plating for general-purpose applications where cost-effectiveness is prioritized over extreme conductivity. Ensure the through-hole mounting method aligns with the PCB manufacturing capabilities.
This part belongs to the Fischer Elektronik SL 11 series of precision-engineered male pin headers. The series is characterized by its narrow 0.635 mm pitch, designed for applications requiring high contact density in limited spaces. The SL 11 124 variant specifically denotes the housing style and contact arrangement within this specialized line of PCB connectors.
Direct substitutes must match the 0.635 mm pitch, 16 positions, and single-row male configuration. Verify that alternative manufacturers offer compatible through-hole straight terminals. Ensure the contact material and plating thickness meet the original performance requirements for the specific application environment.
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