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SL 11 190 14 S is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is ONE ROW, 0.635 MM. Review the specifications below when checking this part for your BOM.
The SL 11 190 14 S is a single-row male pin header connector manufactured by Fischer Elektronik. It features a 2.54 mm (0.100 inch) pitch and provides 14 positions for circuit interconnection. Designed for through-hole mounting, the unit utilizes square-shaped contacts made from copper-tin alloy with a tin surface finish. The insulating housing is constructed from polyamide (PA46), ensuring thermal stability during soldering processes.
Verify that the specific part number matches the required 14-position count and single-row layout. Confirm that the through-hole mounting style aligns with the target printed circuit board design. Ensure the polyamide insulation and tin-plated contact specifications meet the environmental and thermal requirements of the intended application environment before finalizing procurement orders.
Select this component when a standard 2.54 mm pitch male header is required for through-hole implementation. The 14-position count suits moderate density interconnect needs. Consider the PA46 insulation material for standard reflow soldering profiles. This series offers consistent dimensional tolerances suitable for automated assembly processes in electronic manufacturing.
This component belongs to the SL 11 190 series of Fischer Elektronik connectors. The series encompasses various pin counts and configurations within the same mechanical footprint family. Similar variants include different position counts such as the SL 11 190 36 Z or SL 11 190 14 G ECO, sharing identical pitch and mounting characteristics while differing in contact quantity.
Compatible substitutes within the same series include SL 11 190 14 G ECO. Verify that alternative part numbers maintain the exact 14-position count and 2.54 mm pitch. Ensure mechanical dimensions and insulation material properties remain compatible with existing board layouts and thermal processing requirements.
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