SL 11 214 2 G

Headers, Male Pins Overview

The SL 11 214 2 G is a single-row male pin header connector manufactured by Fischer Elektronik. It features a 0.100 inch (2.54 mm) pitch and contains two contacts arranged in one row. The connector utilizes through-hole termination for secure PCB mounting. Contact surfaces are gold-plated to ensure reliable electrical performance. The insulating body is constructed from PA 4.6 GF material, providing structural integrity and thermal stability.

Headers, Male Pins Feature Summary

• Single-row male pin configuration with two positions
• Gold-plated contact surfaces for enhanced conductivity
• Through-hole termination method for board mounting
• PA 4.6 GF insulating body material

Headers, Male Pins Applications

• Board-to-Board interconnections
• Wire-to-Board connections
• General-purpose PCB signal routing

Headers, Male Pins Procurement Notes

Verify the specific ordering suffix 'G' confirms gold plating on contacts as per manufacturer documentation. Ensure the package type matches the required through-hole assembly process. Confirm that the two-position count aligns with the circuit design requirements before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a low-count, single-row male header is required. The gold plating offers superior corrosion resistance compared to tin variants. Verify that the PA 4.6 GF insulation rating meets the environmental conditions of the target application.

Headers, Male Pins Part Context

This part belongs to the SL 11 series of PCB connectors from Fischer Elektronik. The series includes various configurations with different pin counts and termination styles. The SL 11 214 variant specifically denotes a straight, through-hole male header design within this product family.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 2.54 mm pitch, single-row layout, and through-hole termination. Gold-plated contacts are preferred for equivalent durability. Verify mechanical dimensions and insulation material compatibility with existing PCB footprints.