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SL LP 6 SMD 051 22 Z PS is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is 0.635 MM, LOW PROFILE IN SMD-T. Review the specifications below when checking this part for your BOM.
The SL LP 6 SMD 051 22 Z PS is a male header connector manufactured by Fischer Elektronik. It features a surface mount design with 22 positions and a 0.100 inch (2.54 mm) pitch. The component utilizes a low profile structure with a height of 0.635 mm, optimized for space-constrained applications. Contact plating consists of nickel underplating with gold overplating of at least 0.2 micrometers thickness. The device supports operating temperatures ranging from -40°C to +163°C and withstands soldering heat at +260°C for 10 seconds.
Verify the specific ordering suffix against official Fischer Elektronik documentation to confirm contact plating specifications and pin configuration. Ensure compatibility with automated surface mount assembly processes. Confirm that the selected variant meets the required thermal endurance standards for the intended manufacturing environment.
Select this component when a low-profile 2.54 mm pitch header is required for surface mounting. Consider the 0.635 mm height constraint and the need for gold-plated contacts in corrosive environments. Verify that the 22-position count matches the circuit requirements and that the operating temperature range aligns with system specifications.
This part belongs to the SL LP 6 SMD series of low-profile connectors from Fischer Elektronik. The series offers various position counts and plating options. The 'Z' suffix typically denotes specific plating or packaging variations within the product line. The model provides a standardized solution for high-density PCB interconnects requiring robust mechanical stability.
Direct substitutes include variants such as SL LP 6 SMD 051 22 S or SL LP 6 SMD 051 22 Z B SM PS from Fischer Elektronik. These alternatives share the same physical dimensions and pitch but may differ in contact plating or packaging. Verify functional equivalence before substitution.
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